Manufacturing method for near ultraviolet LED device
An LED device and near-ultraviolet technology, applied in the field of optoelectronics, can solve the problems of not improving the light extraction efficiency of GaN-based LEDs, not easy to low color temperature, and low color rendering index, so as to improve the light extraction efficiency, improve the light output efficiency, enhance the Effect of light extraction rate
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[0028] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0029] refer to figure 1 , the lowest layer of the device of the present invention is a sapphire substrate, the sapphire lining is low-temperature AlN buffer layer, the low-temperature AlN buffer layer is an undoped GaN nucleation layer, there is an air gap at the interface between the two, and the GaN nucleation layer is It is an n-type GaN buffer layer, and the interface between the two is DBR (SiO 2 / SiN 4 ) Multi-layer dielectric layer film structure, n-type GaN buffer layer is In x Ga 1-x N / Al y Ga l-y A multi-quantum well active region composed of N, a p-type AlGaN cladding layer on the multi-quantum well active region, and a p-type GaN contact layer on the cladding layer.
[0030] The fabrication of the device of the present invention includes two steps of material growth and device fabrication.
[0031] refer to figure 1 , the m...
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