Heat-removal LED (light-emitting diode) integrating SiC substrate and diamond film

Abstract

The invention discloses a heat-removal LED (light-emitting diode) integrating a SiC substrate and a diamond film, and the LED comprises a PCB (printed circuit board) (7) and is characterized in that the heating surface of the PCB (7) is contacted with the bottom surface of a diamond substrate (6), the upper bottom surface of the diamond substrate (6) is connected with an active layer (2) by virtue of an inverted welding layer, and the active layer (2) grows on a SiC epitaxial substrate (1); and a P-type electrode (4) and an N-type electrode (8) which are used for controlling the current of the active layer (2) are arranged on the diamond substrate (6) and connected with the PCB (7) by virtue of corresponding electrode lines (5, 9), and the PCB (7) is controlled by a temperature sensor (10) so as to implement the current adjustment, thereby controlling the light-emitting amount of the active layer (2) so as to ensure that the active layer (2) operates within the optimum temperature range. By using the LED disclosed by the invention, the heat dissipation effect is greatly increased, and the service life of an LED particle can be increased by more than 20%.

Description

technical field [0001] The invention relates to a manufacturing and packaging technology of LED particles, in particular to a high-power LED with good heat dissipation effect, in particular to an LED integrated with a SiC substrate and a diamond film for heat dissipation. Background technique [0002] As we all know, one of the outstanding advantages of LEDs that distinguishes them from traditional light sources is that they are small in size and compact in structure, and can be easily embedded in various lamps to form application systems that meet different requirements. And only when LEDs are combined with lamps can they give full play to their advantages. High-power white light LED is a new type of semiconductor solid light source, which has the advantages of strong safety and reliability, high power consumption, high luminous efficiency, strong applicability, good stability, short response time, changeable color, and environmental protection. Its performance is cons...

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Problems solved by technology

[0003] The purpose of the present invention is to design an integrated SiC matrix that integrates SiC and diamond substrates as heat transfer elements for the problem that most of the current LED particles are grown on silicon wafers, and the silicon wafers have poor thermal conductivity and heat dissipation performance, thus affecting the life of LEDs. LED with diamond film heat dissipation

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