Thermosetting epoxy resin composition and epoxy fiberglass cloth-based copper clad laminate prepared from same

Abstract

The invention relates to a thermosetting epoxy resin composition and an epoxy fiberglass cloth-based copper clad laminate prepared from the same. The thermosetting epoxy resin composition comprises the following components: epoxy resin, poly(1,4-butanediol) bis(4-aminobenzoate) and a curing agent. The epoxy fiberglass cloth-based copper clad laminate prepared from the thermosetting epoxy resin composition comprises a plurality of mutually overlapped prepregs, and copper foils arranged on one side or two sides of the overlapped prepregs, wherein each prepreg comprises fiberglass cloth and the thermosetting epoxy resin composition which is subjected to impregnated drying and attached to the fiberglass cloth. The poly(1,4-butanediol) bis(4-aminobenzoate) is adopted as a flexibilizer, so thatgood flexibility is achieved and the glass transition temperature (Tg) of a prepared board is slightly reduced or not reduced, and a general problem that the Tg of the copper clad laminate is reduceddue to conventional flexibilizers in the prior art is solved. The flexibility of the epoxy fiberglass cloth-based copper clad laminate is obviously improved, and the epoxy fiberglass cloth-based copper clad laminate can partially replace high-cost flexible copper clad laminate in places such as rigid-flex boards, static flexibility, parallel lifting and the like.

Description

technical field [0001] The invention relates to a thermosetting epoxy resin composition, in particular to a thermosetting epoxy resin composition and an epoxy glass fiber cloth-based copper-clad board made by using the thermosetting epoxy resin composition. Background technique [0002] With the miniaturization and multi-functional development of electronic equipment, high-density and high-performance PCBs are required. The design of electronic products is also increasingly considering special forms such as rigid-flex combination, parallel-elevated three-dimensional assembly, and static deflection. Under this premise, flexible boards and rigid-flexible boards have shown advantages. At present, the flexible parts of flexible boards and rigid-flexible boards use PI as a reinforced flexible circuit. Although the flexural performance is good, the cost is high and the price is expensive; The requirements of the song occasion caused a waste of performance. Under this premise, t...

AI Technical Summary

Problems solved by technology

At present, the flexible parts of flexible boards and rigid-flexible boards use PI as a reinforced flexible circuit. Although the flexural performance is good, the cost is high and the price is expensive; The requirements of the song scene, resulting in a waste of performance

Under this premise, the concept of flexible FR-4 is proposed. The traditional FR-4 copper clad laminate has poor flexural performance and high brittleness. It is easy to cause resin fracture under bending and flexing, which in turn leads to wire fracture. fail

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