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A kind of chemical nickel plating solution and chemical nickel plating process

A technology of electroless nickel plating solution and nickel salt, which is applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of reliability impact, reduce the thickness of nickel layer, etc., reduce stress and improve yield , the effect of improving toughness

Inactive Publication Date: 2011-12-07
SHENZHEN JINGCHENGDA CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But reducing the thickness of the nickel layer, especially when the thickness of the nickel layer is less than 2 μm, the reliability of the soldering will be affected when soldering, especially when lead-free soldering, and there is a potential risk to the use of the product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Electroless nickel plating solution, containing the following components:

[0046] Nickel sulfate: Ni 2+ The content is calculated as 4.5g / L;

[0047] Sodium hypophosphite: 20g / L;

[0048] Glycine: 4g / L;

[0049] Lactic acid: 25g / L;

[0050] Succinic acid: 10g / L;

[0051] Pb 2+ : 1mg / L;

[0052] Potassium fluoride: 0.5g / L;

[0053] Sodium naphthalene disulfonate: 2g / L;

[0054] Coumarin: 0.15g / L;

[0055] The rest is deionized water.

[0056] After the electroless nickel plating solution is prepared according to the above-mentioned components and contents, it is used for the electroless nickel plating of a cylindrical metal rod with a diameter of 1mm. The electroless nickel plating process is: in the nickel plating process, control the above electroless nickel plating solution The temperature is 80°C, the pH value of the electroless nickel plating solution is 4.90, and the electroless nickel plating time is 20 minutes. After the nickel plating is completed, t...

Embodiment 2

[0058] Electroless nickel plating solution, containing the following components:

[0059] Nickel sulfate: Ni 2+ The content is calculated as 5.0g / L;

[0060] Sodium hypophosphite: 25g / L;

[0061] Aminotrimethylene phosphonic acid (ATMP): 4g / L;

[0062] Lactic acid: 25g / L;

[0063] Succinic acid: 10g / L;

[0064] Pb 2+ : 1mg / L;

[0065] Potassium fluoride: 0.5g / L;

[0066] Butynediol: 2g / L;

[0067] Acetic acid: 1.5g / L;

[0068] The rest is deionized water.

[0069] After the electroless nickel plating solution is prepared according to the above-mentioned components and contents, it is used for the electroless nickel plating of a cylindrical metal rod with a diameter of 1mm. The electroless nickel plating process is: in the nickel plating process, control the above electroless nickel plating solution The temperature is 80°C, the pH value of the electroless nickel plating solution is 4.90, and the electroless nickel plating time is 20 minutes. After the nickel plating ...

Embodiment 3

[0071] Electroless nickel plating solution, containing the following components:

[0072] Nickel sulfate: Ni 2+ The content is calculated as 5.5g / L;

[0073] Sodium hypophosphite: 30g / L;

[0074] Glycine: 5g / L;

[0075] Lactic acid: 20g / L;

[0076] Malic acid: 10g / L;

[0077] Pb 2+ : 1mg / L

[0078] Potassium fluoride: 0.5g / L;

[0079] Sodium naphthalene disulfonate: 2g / L;

[0080] Saccharin: 2g / L;

[0081] The rest is deionized water.

[0082] After the electroless nickel plating solution is prepared according to the above-mentioned components and contents, it is used for the electroless nickel plating of a cylindrical metal rod with a diameter of 1mm. The electroless nickel plating process is: in the nickel plating process, control the above electroless nickel plating solution The temperature is 80°C, the pH value of the electroless nickel plating solution is 4.90, and the electroless nickel plating time is 20 minutes. After the nickel plating is completed, the thi...

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Abstract

The invention relates to an electroless nickel plating solution and an electroless nickel plating process for a flexible printed circuit board. The electroless nickel plating solution of the present invention comprises the following components: nickel salt, calculated as Ni2+ content, is 4.5-5.5g / L; reducing agent, 15-40g / L; complexing agent, 20-100g / L Stabilizer, 0.01~10mg / L; Accelerator, 0.001~1g / L; Low stress additive, 0.01~10g / L; The low stress additive is sodium naphthalene disulfonate, sodium benzenesulfonate, saccharin, gelatin, One or more of butynediol, acetic acid, coumarin, formaldehyde, and acetaldehyde. In the chemical nickel plating process of the present invention, the temperature of the chemical nickel plating liquid is 75-90 DEG C, the pH value of the chemical nickel plating liquid is 4.5-5.4, and the chemical nickel plating time is 15-30 minutes. The electroless nickel plating solution and the electroless nickel plating process of the present invention can effectively reduce the stress of the nickel layer, improve the toughness of the nickel layer, make the nickel layer have good bending performance, and meet the production and assembly requirements of flexible printed circuit boards , to further improve the yield rate.

Description

technical field [0001] The invention belongs to the field of printed circuit boards, and relates to an electroless nickel-gold plating process for flexible printed circuit boards, in particular to an electroless nickel plating solution and an electroless nickel plating process for flexible printed circuit boards. Background technique [0002] Electronic products continue to develop towards the trend of light, thin, small and multi-functional. In addition to the original function of signal transmission, flexible printed circuit boards are also gradually developing in the direction of high-density thin lines and carrier boards as active and passive components. Applications The field has also shifted from PC-related and consumer electronics products to the flat panel display and IC packaging industries with more sophisticated manufacturing processes. In addition to the function of connecting the panel, the high-density flexible printed circuit board can also carry active and pa...

Claims

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Application Information

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IPC IPC(8): C23C18/36
Inventor 陈兵
Owner SHENZHEN JINGCHENGDA CIRCUIT TECH
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