Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A Ku-band waveguide-based spatial four-way power combiner

A technology of synthesizing device and inner space, which is applied to connecting devices, waveguide-type devices, circuits, etc., can solve problems such as large volume, save space, facilitate debugging, and solve power supply difficulties.

Inactive Publication Date: 2011-09-28
上海新杰芯微波技术有限公司
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is a microelectronics institute in China that developed a C-band 2×4-layer space power combining module in December 2007, and the combining efficiency reached 75%. The 4-way spatial power combining network combined with the waveguide-microstrip double-probe transition has a combining efficiency higher than 86% in the Ku band, but the combining is not carried out in the waveguide, and the waveguide power divider / combiner and the waveguide- The volume of the 4-way spatial power combining network combined with the microstrip double-probe transition is large

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A Ku-band waveguide-based spatial four-way power combiner
  • A Ku-band waveguide-based spatial four-way power combiner
  • A Ku-band waveguide-based spatial four-way power combiner

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] Please refer to the accompanying drawings for a further description of the present invention.

[0035] As shown in Figure 1, the double-channel single-sided fin line amplifying circuit board 1 has two parallel microstrip lines 102 on its front side, and a power amplifier chip 101 is arranged on the microstrip line 102; its back side is a double fin line 104, There are flying lead holes 103 on both sides of the microstrip line 102 . The power supply of the two power amplifier chips 101 is respectively on both sides of the microstrip line 102, one of which can be directly powered, and the other can not be directly powered because the power supply terminal is too close to the previous chip. One side of the flying wire method, place the bias circuit on a relatively empty position on the board, use the flying wire to pass through the flying wire hole 103 from the back of the circuit board 1 and solder it to the flying wire hole 103 on the front of the circuit board 1, and am...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a Ku-band waveguide-based spatial four-way power combiner, which is characterized in that: two pieces of one side finline amplifier PCBs with double channels, which are vertical to an E surface of waveguide, are placed symmetrically in the waveguide as a mode of 2+2; the two pieces of one side finline amplifier PCBs with double channels are isolated by a cushion block so that there is a gap between the two pieces of one side finline amplifier PCBs with double channels. In the invention, four-way power combination is achieved by two pieces of PCBs and the combination is performed in the waveguide, which saves spaces and reduces the volume of the model. Combined efficiency is more than 80%.

Description

technical field [0001] The invention relates to the field of spatial power combining in a waveguide, in particular to a 4-way combining device for combining spatial power in a Ku-band waveguide. Background technique [0002] Nowadays, some military and commercial communication systems require higher and higher output power of high-power solid-state amplifiers. In order to obtain high-power output to meet the needs of these systems, the single power device based on semiconductor technology or vacuum microelectronics technology can be improved. The output power can also use power combining technology to superimpose the output power of multiple solid-state devices in phase to obtain the desired power output. However, from two aspects of cost and reliability, the power combining solid-state amplifier system has obvious advantages. Among the existing power combining categories, compared with chip-level and circuit-level power combining, the advantage of spatial power combining i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/12
Inventor 汪书娜黄光煌张寅侃李凌云王斌
Owner 上海新杰芯微波技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com