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Impregnation liquid used in copper clad plate preparation process

A preparation process and impregnating liquid technology, applied in layered products, metal layered products, glass/slag layered products, etc., can solve problems such as high loss factor, low peel strength, and small surface insulation resistance

Inactive Publication Date: 2011-08-31
吴江市东风电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the copper clad laminates in the prior art have high dielectric loss factor, small surface insulation resistance, low bending strength, and low peel strength.

Method used

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  • Impregnation liquid used in copper clad plate preparation process

Examples

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Embodiment 1

[0015] An immersion solution used in the preparation of copper clad laminates, the immersion solution includes a first immersion solution and a second immersion solution, the first immersion solution is composed of perfluoroalkoxy concentrated dispersion solution and distilled water in a volume ratio of 1:1.4 When mixing, put the two into a stirrer, stir at a speed of 200r / min for 30 minutes, filter with EW60 glass fiber cloth, and obtain the first impregnating liquid; the second impregnating liquid is made of perfluoroalkoxy Concentrated dispersion liquid, polytetrafluoroethylene concentrated dispersion liquid and distilled water are mixed uniformly at a volume ratio of 1:12:6. When mixing, put the three substances into the stirrer and stir at 200r / min for 30-90 Minutes, filter with EW60 glass fiber cloth to get the second impregnation solution.

[0016] Each material performance index described in the present invention is as follows:

[0017] Perfluoroalkoxy concentrated di...

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Abstract

The invention discloses an impregnation liquid used in a copper clad plate preparation process, which comprises a first impregnation liquid and a second impregnation liquid, wherein the first impregnation liquid is formed by stirring and mixing a perfluoro-alkoxy concentrated dispersion and distilled water in a volume ratio of 1:1.4; and the second impregnation liquid is formed by evenly mixing a perfluoro-alkoxy concentrated dispersion, a polytetrafluoroethylene concentrated dispersion and distilled water in a volume ratio of 1:12:6. The dielectric loss factor of the copper clad plate with glass fiber cloth impregnated by the impregnation liquid disclosed by the invention is reduced from 1*<-3> to 7*10<-4>, the surface insulation resistance is raised from 1*10<10> to 10<15> on average, the bending strength is raised from 80 MPa to 120 MPa on average, and the peel strength is raised from 1.5kN / m to 2.3kN / m on average.

Description

technical field [0001] The invention relates to an impregnating liquid used for impregnating a medium cloth in the preparation process of a copper-clad laminate. Background technique [0002] Printed circuit boards are widely used in computer, communication, instrumentation, military industry, automobile, scientific equipment and other fields to provide identification and graphics for component insertion, welding, inspection and maintenance. The substrate of the printed circuit board is also called a copper clad laminate. With the gradual development of high-speed and high-frequency communication and electronic products, the market demand for high-frequency high-performance PTFE copper-clad laminates is also growing rapidly. [0003] PTFE copper-clad laminate is made of glass fiber cloth through a series of treatments to obtain dielectric cloth, which is impregnated with an impregnating solution mixed with concentrated polytetrafluoroethylene dispersion and distilled water,...

Claims

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Application Information

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IPC IPC(8): C08L27/18C08K13/04C08K7/14C08J5/04B32B15/14B32B15/20B32B17/02
Inventor 马立萍禹胜林沈海平
Owner 吴江市东风电子有限公司
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