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Stripping transfer method of substrate of thin film solar cell

A solar cell, stripping transfer technology, applied in the direction of circuits, electrical components, sustainable manufacturing/processing, etc., can solve the problems of limited use range, heavy weight of thin-film batteries, and unsatisfactory, and achieve a wide range of applications, light specific gravity, and high The effect of flatness

Inactive Publication Date: 2011-08-17
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the use of a hard substrate, the thin-film battery is rigid and cannot meet the application on non-planar materials such as balloons and airships on curved surfaces, which limits its application range
On the other hand, since the material of the hard substrate is generally glass, resin, metal or other rigid materials, which have high density and large volume, the overall weight of the thin film battery is relatively large.
A conventional thin-film solar cell epitaxial layer is only about 10 μm effective, while the supporting substrate is 300-500 μm thick, making more than 95% of the weight of the thin-film solar cell ineffective

Method used

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  • Stripping transfer method of substrate of thin film solar cell

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Embodiment Construction

[0023] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0024] like Figure 1 to Figure 3 Shown, a kind of stripping transfer method of thin-film solar cell substrate, its concrete steps are as follows:

[0025] 1. Select a hard substrate 1. The commonly used hard substrate 1 is a GaAs substrate with a thickness between 300-500 μm. Its smoothness and hardness can ensure the high flatness and precision of the material layer deposited and grown on it.

[0026] The material aluminum arsenide (AlAs) is deposited and grown on the hard substrate 1 by molecular beam epitaxy (MBE) or metal organic chemical vapor deposition (MOCVD) to form a corrosion sacrificial layer 2 with a thickness of 0.5 μm. The corrosion sacrificial layer 2 is not a structure contained in the finished battery, but a material layer inserted for the realization of the subsequent lift-off transfer technology.

[0027] 2. Fabricat...

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Abstract

The invention relates to a stripping transfer technology of a substrate of a thin film solar cell, particularly comprising the following steps of: firstly depositing and growing a corrosion sacrifice layer on a rigid substrate; then depositing and growing a solar cell layer on the completely grown corrosion sacrifice layer; heating black waxes for thawing on the solar cell layer, and naturally condensing to normal temperature to fix on the surface of the solar cell layer to form a support layer; placing the solar cell layer with the support layer in selective corrosive liquid to soak at the normal temperature for 6-8 hours so that the corrosion sacrifice layer positioned between the solar cell layer and the rigid substrate is completely corroded to be eliminated; transferring and fixing the solar cell layer stripped from the rigid substrate to a flexible substrate under the action of the support layer; and finally dissolving to eliminate the support layer fixed on the surface of the solar cell layer by adopting a dissolving agent. The invention realizes the lightweight and the flexibleness of the thin film solar cell, thereby enlarging the application range of the thin film solar cell.

Description

technical field [0001] The invention relates to a thin-film solar cell, more precisely, provides a method for peeling and transferring a substrate of a thin-film solar cell, and belongs to the technical field of the thin-film solar cell and its manufacturing process. Background technique [0002] Existing mass-produced semiconductor solar cells are mainly made of materials such as polycrystalline silicon and amorphous silicon. The substrate is generally made of rigid material. Due to the use of a hard substrate, the thin-film battery is rigid and cannot meet the application on non-planar materials such as balloons and airships with curved surfaces, which limits its application range. On the other hand, because the material of the hard substrate is generally glass, resin, metal or other rigid materials, it has a high density and a large volume, resulting in a large overall weight of the thin film battery. The epitaxial layer of a conventional thin-film solar cell is only ab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18H01L31/20
CPCY02P70/50
Inventor 殷志珍黄寓洋崔国新张宇翔冯成义李文张耀辉
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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