Flip-chip construction maintaining solder positioning
A flip-chip packaging, welding positioning technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of electrical connection failure, general products do not have suitable structures, and the cost of flip-chip bonding machines is expensive. The effect of reliability
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no. 1 Embodiment
[0054] According to the first embodiment of the present invention, a flip-chip package structure for maintaining soldering positioning is exemplified in figure 2 cross-sectional diagram of Figure 3A to Figure 3C Schematic cross-sectional view of components during flip-chip bonding and Figure 4A and Figure 4B A partial top view of its wafer and substrate is shown. The flip-chip package structure 200 for maintaining soldering position mainly includes a chip 210 and a substrate 220 .
[0055] see figure 2 Shown is a schematic cross-sectional view of a flip-chip package structure for maintaining soldering positioning according to the first embodiment of the present invention. The active surface 211 of the wafer 210 is provided with a plurality of bumps 212 and at least one embossed base mark 213 . In detail, the active surface 211 may additionally be formed with a plurality of solder pads (not shown in the figure) for connecting the bumps 212, and an UBM layer ( not sho...
no. 2 Embodiment
[0072] According to the second specific embodiment of the present invention, another flip-chip package structure for maintaining soldering positioning is illustrated in Figure 7 The cross-sectional diagram of the Figure 8 Schematic cross-section of the component. The main components that are the same as those in the first embodiment will be marked with the same symbols and will not be described in detail again.
[0073] The present invention is not limited to the MPS-C2 product, and can also be used in a flip-chip packaging structure bonded by solder balls. see Figure 7 Shown is a schematic cross-sectional view of another flip-chip package structure for maintaining soldering positioning according to the second embodiment of the present invention. The flip-chip package structure 300 for maintaining soldering position mainly includes a chip 210 and a substrate 220 . The wafer 210 is provided with a plurality of bumps 212 and at least one embossed mark 213 on its active su...
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