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Mask for semiconductor process

A semiconductor and mask technology, which is used in photomechanical processing of originals, patterned surface photoengraving process, optics, etc., can solve the problems of long time, increase production cost, high cost, etc. The effect of production costs

Active Publication Date: 2011-07-27
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is very expensive to use this dedicated mask detection system to detect mask contamination, and it takes a long time (2 to 4 hours per mask), which not only affects the production efficiency of semiconductor devices, but also increases Production costs, which are unaffordable for SMEs

Method used

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  • Mask for semiconductor process
  • Mask for semiconductor process
  • Mask for semiconductor process

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Embodiment Construction

[0055] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.

[0056] In order to thoroughly understand the present invention, detailed steps will be presented in the following description to illustrate how the present invention uses a mask detection pattern to detect mask contamination. Obviously, the practice of the invention is not limited to specific details familiar to those skilled in the semiconductor arts. Preferred embodiments of the present invention are described in detail below, however, the present invention may have other embodiments besides these detailed descriptions.

[0057] Such as image 3 As shown, a...

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Abstract

The invention provides a mask for a semiconductor process, which has a mask detection pattern with at least one repeated graphic formed on a position without a target pattern on the mask. The invention also provides a method for manufacturing the mask for the semiconductor process, wherein the mask detection pattern has at least one repeated graphic formed on the position without the target pattern on the mask. The invention provides a method for detecting mask pollution by adopting the mask, which comprises the following steps of: transferring the mask detection pattern to a wafer; comparing the mask detection pattern on the wafer, and determining whether the mask is polluted according to different situations of graphics of the mask detection pattern on the wafer; or determining that the mask is polluted when the mask detection pattern on the wafer is not the repeated graphic.

Description

technical field [0001] The present invention relates to a semiconductor manufacturing process, in particular to a mask used in the semiconductor process. Background technique [0002] In the production process of integrated circuits, photolithography has long been an indispensable technology. The photolithography process is mainly to first form the designed pattern, such as circuit pattern, contact hole pattern, etc. on one or more masks, and then transfer the pattern on the mask to the on the photoresist layer on the wafer. Only a sophisticated photolithography process can smoothly transfer the layout pattern to the photoresist layer on the wafer accurately and clearly. [0003] As the size of semiconductor components shrinks day by day, how to improve the resolution of the photolithography process has become a key issue. In many existing resolution enhancement techniques (RIE), phase shift mask (PSM) has been one of the important tools used to improve resolution. Gener...

Claims

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Application Information

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IPC IPC(8): G03F1/14
Inventor 田彬
Owner SEMICON MFG INT (SHANGHAI) CORP
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