Swelling solution for removing through-hole residues of epoxy resin circuit board

Abstract

The invention relates to a swelling solution for removing through-hole residues of an epoxy resin circuit board, in particular to a swelling solution for removing through-hole residues, which is suitable for a high-Tg epoxy resin circuit board (Tg refers to a glass-transition temperature, similarly hereafter; and high Tg indicates that the glass-transition temperature is greater than 150 DEG C, similarly hereafter). The swelling solution is composed of a water solution of a tetrahydrofuran derivate and hexanediol, and the addition amounts of the tetrahydrofuran derivate and the hexanediol are respectively 100-500g / L and 10-100g / L; and a structural formula of the tetrahydrofuran derivate is shown in the specification, wherein n is selected from 3 to 8. Because the tetrahydrofuran derivate has an effective swelling effect on epoxy resin, the residues in holes of the circuit board can be thoroughly removed after being treated by a potassium permanganate solution; meanwhile, the damage to the performance of the circuit board treated by the potassium permanganate solution cannot be caused even if a little of swelling solution is brought into the potassium permanganate solution.

Description

technical field The present invention is applicable to the swelling solution for removal of through-hole residues of epoxy resin material circuit boards with high Tg (Tg means glass transition temperature, the same below; high Tg means the glass transition temperature is greater than 150°C, the same below), specifically, It relates to a technical method for removing residues after the circuit board is drilled, that is, in order to remove the residues in the through holes well, before performing potassium permanganate oxidation treatment, the circuit board is immersed in the swelling solution of the present invention, so that the residue in the hole After the residue is expanded, it can be effectively removed, and at the same time, it can increase the treatment effect of potassium permanganate on the epoxy resin of the hole wall, and enhance the adhesion strength of the copper plating layer in the subsequent electroless plating process. Background technique For the connection...

AI Technical Summary

Problems solved by technology

Although the swelling solution of the above-mentioned patent can effectively remove the residue in the hole of the high Tg epoxy resin circuit board, the adhesion strength of the copper plating layer needs to be further improved