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Re-peelable adhesive sheet

A releasable, adhesive sheet technology, applied in the direction of adhesive types, ester copolymer adhesives, film/sheet adhesives, etc., which can solve the adverse health effects of operators, strong odor, etc. problem, to achieve the effect of reducing warpage, reducing pollution and easy peeling

Active Publication Date: 2011-06-15
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] In addition, the most attention-grabbing adhesive sheet is the radiation-curable adhesive sheet. When the adhesive layer is cured by irradiation with radiation, a strong odor is generated, which may adversely affect the health and hygiene of workers.

Method used

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  • Re-peelable adhesive sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0092] 100 parts of n-butyl acrylate, 3 parts of acrylic acid, and 0.1 part of 2,2'-azobisisobutyronitrile were mixed at 25°C so that the total volume was 200 g, and put into a flask with an inner capacity of 500 ml. The flask was stirred while introducing nitrogen gas into the flask for about 1 hour, and the inner air was replaced with nitrogen gas. Thereafter, the container was heated to raise the internal temperature to 60° C., and the state was maintained for about 6 hours to perform polymerization to obtain a polymer solution.

[0093] Add 2g polyisocyanate compound (manufactured by Nippon Polyurethane Industry Co., Ltd.: CORONATE L), 0.5g polyfunctional epoxy compound (manufactured by Mitsubishi Gas Chemical: TETRAD C) to 100 g of the obtained polymer solution, dilute with ethyl acetate, stir until uniform, A binder solution is obtained.

[0094] The resulting adhesive solution was coated on a polyester film (PET, 50 μm thick) as a substrate, and dried in a drying oven ...

Embodiment 2

[0096] A pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that a polyimide film (PI, 50 μm thick) was used as the substrate instead of the polyester film.

Embodiment 3

[0098] A pressure-sensitive adhesive sheet was produced in the same manner as in Example 1, except that polyethylene naphthalate (PEN, 50 μm thick) was used as the substrate instead of the polyester film.

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Abstract

A re-peelable adhesive sheet for grinding a semiconductor wafer comprises: a base film, and an adhesive layer laminated on the base film, the re-peelable adhesive sheet has a modulus of elasticity of at least 103 MPa, and a heating shrinkage factor of 1% or less, after heating for 10 minutes to 60 DEG C., and the adhesive layer is set to a thickness at which the maximum point stress is 200 g / cm or less, at a pressing amount of 30 [mu]m from the adhesive layer side in a three-point bend test. The present invention can provide a re-peelable adhesive sheet that can reduce wafer warping, cracking, and edge chipping, that can improve the adhesive force in relation to temperature variations and / or reduce contamination of the adherend when re-peeling, and that can facilitate film re-peel.

Description

technical field [0001] The present invention relates to a re-peelable pressure-sensitive adhesive sheet, and more specifically, to a re-peelable pressure-sensitive adhesive sheet used in a semiconductor manufacturing process. Background technique [0002] In recent years, along with miniaturization of various electronic devices and popularization of IC cards, it is necessary to form a thin film of, for example, about 50 μm or less on a semiconductor wafer. In addition, further enlargement of the wafer diameter is being studied in order to improve productivity. [0003] Usually, in the manufacture of a semiconductor wafer, after forming a circuit pattern on the surface of the wafer, the back surface of the wafer is ground with a grinder or the like to adjust to a predetermined thickness. At this time, in order to protect the wafer surface, an adhesive sheet is usually attached to the wafer surface, and the backside grinding is performed. In addition, after the wafer is grou...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J133/00C09J133/08H01L21/68C09J7/22C09J7/38
CPCB32B7/12B32B15/08C09J7/0246C09J2433/00C09J7/02C09J2203/326B32B7/06B32B27/16B32B27/281B32B27/302B32B27/304B32B27/32B32B27/34B32B27/36B32B27/40B32B2307/308B32B2307/50B32B2307/51B32B2307/748B32B2405/00B32B2457/14C09J7/38C09J7/22Y10T428/2891Y10T428/28Y10T428/265
Inventor 土生刚志浅井文辉新谷寿朗佐佐木贵俊水野浩二
Owner NITTO DENKO CORP
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