Method for manufacturing dual-layer sandwiched metal base PCB (printed circuit board) with high thermal conductivity

Abstract

The invention relates to a method for manufacturing a dual-layer sandwich metal base PCB (printed circuit board) with high thermal conductivity. According to the method, a copper base or aluminum base is used for replacing the FR4 insulation material base or ceramic base in the prior art. According to the invention, the high terminal conductively of metal is utilized, so that heat threats to most electronic power devices and an LED (light emitting diode) on the PCB can be greatly reduced or eliminated, thus the lowest running temperature, greatest luminosity and longest service life of the LED can be ensured, therefore, the PCB is an ideal carrier board for the electronic power devices and an LED array.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a novel method for preparing a metal-based printed circuit board with high thermal conductivity. Background technique [0002] Printed Circuit Board (PCB) is one of the important components of the electronics industry. PCB can provide fixed and assembled mechanical support for electronic components, and can realize electrical connection between electronic components. In addition, the component numbers and some graphics are printed on the PCB, which provides convenience for component insertion, inspection and maintenance. Almost every kind of electronic equipment, ranging from electronic watches and calculators to large computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed circuit boards are used for the electrical interconnection between them. [0003] The tradit...

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Problems solved by technology

[0003] The traditional printed circuit board adopts a hole metallization structure, the insulating material between the layers is FR4 material, the thermal conductivity of the insulating material between the layers is 0.4W / mk, and the heat transfer capacity is low; in recent years, the development Although ceramic-based printed circuit boards can provide relatively good heat conduction, the brittle characteristics of ceramics still cannot meet the mechanical properties, machinability and dimensional stability of electrical device substrates.

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