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Radiating module

A technology of heat dissipation module and heat dissipation fin set, which is applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating renovation, etc. question

Inactive Publication Date: 2011-03-23
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since the heat source is located far away from the fan and the cooling fin assembly, part of the heat will be lost to the system during the process of heat transfer from the heat source to the cooling fin assembly, resulting in an increase in the internal temperature of the system
Stability affecting system performance
In addition, the heat dissipation assembly includes many parts, and when assembling the heat dissipation assembly on the circuit board where the heating element is located, not only the fan but also the heat conduction element need to be fixed, which makes the installation process extremely cumbersome
Furthermore, the heat dissipation component is large in size and needs to occupy more system installation space, which is contrary to the development trend of notebook computers towards thinner and smaller

Method used

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  • Radiating module
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Examples

Experimental program
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Embodiment Construction

[0012] see figure 1 and figure 2 , the cooling module 100 includes a centrifugal fan 10 , two heat absorbing plates 20 embedded in the bottom of the centrifugal fan 10 , a heat pipe 30 and a cooling fin set 40 housed in the centrifugal fan 10 .

[0013] The two heat-absorbing plates 20 are made of a metal material such as copper with good thermal conductivity, and the two heat-absorbing plates 20 are square and rectangular, and are used to be pasted on the heat-generating electronic components (not shown) to absorb heat generated by the heat-generating electronic components. of heat.

[0014] The heat pipe 30 is roughly U-shaped, and includes an L-shaped evaporating section 32 and a straight-line condensing section 34 . A vacuum-tight chamber is formed inside the heat pipe 30, and a working liquid (not shown) is disposed in the chamber. The heat pipe 30 is flat and includes a top surface 31 and a bottom surface 33 parallel to the top surface 31 .

[0015] The centrifugal ...

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Abstract

The invention discloses a radiating module. The radiating module comprises a centrifugal fan, a heat pipe and a radiating fin group, wherein an air outlet is formed in the side direction of the centrifugal fan; the radiating fin group is arranged at the air outlet; the heat pipe is provided with an evaporation section and a condensation section; the evaporation section of the heat pipe is connected with the centrifugal fan; the evaporation section of the heat pipe is positioned in an area covered by the centrifugal fan; and the condensation section of the heat pipe is connected with the radiating fin group.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module suitable for heat dissipation of heating electronic components. Background technique [0002] With the rapid development of the computer industry, the CPU pursues high-speed, multi-functional and miniaturized heat dissipation problems are becoming more and more serious. Therefore, the heat must be dissipated in a timely and effective manner, otherwise it will greatly affect the work of electronic components. performance while reducing the life of electronic components. [0003] In a notebook computer, a cooling module is usually used to dissipate heat from heat-generating electronic components such as a CPU. For example, Chinese Patent Application Publication No. 200710141298.8 discloses a heat dissipation assembly. The cooling assembly includes a fan, a cooling fin assembly, a heat pipe and a heat conducting element. The heat conducting element is thermal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/427H01L23/467G06F1/20
CPCF28D15/0233G06F1/203
Inventor LIANG ZHENGRENHONG RUIWENZHENG NIANTIAN
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD
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