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Method and apparatus for processing brittle material substrate

A brittle material substrate, brittle material technology, applied in stone processing tools, fine working devices, stone processing equipment, etc., can solve problems such as sudden breakage and inability to form scribe grooves, and achieve the effect of shortening processing time

Inactive Publication Date: 2011-03-23
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The reason why the cutter wheel 32 with a larger ridge angle is used for scribing is that if a blade with a smaller ridge angle is used, the scribe groove cannot be formed, and there is a possibility of sudden fracture when the load is slightly exceeded.

Method used

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  • Method and apparatus for processing brittle material substrate
  • Method and apparatus for processing brittle material substrate
  • Method and apparatus for processing brittle material substrate

Examples

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Embodiment Construction

[0066] Hereinafter, the processing method of this invention is demonstrated in detail based on drawing which shows this embodiment.

[0067] figure 1 A perspective view showing an example of a processing device A used when implementing the processing method of the present invention. The processing apparatus A is equipped with the stage 10 which can move in a substantially horizontal direction (Y direction), and can rotate in a horizontal plane. The stage 10 is equipped with the vacuum suction mechanism (not shown) for holding the glass substrate W.

[0068] The bridge member 13 formed by the support columns 11 and 11 on both sides of the platform 10 and the guide rod 12 extending in the X direction is arranged to straddle the platform 10 and is formed to be movable by a moving mechanism not shown in the figure. in the Y direction. The slider 14 is attached so as to be movable by the guide 15 formed on the guide bar 12 and is moved in the X direction by the rotation of the ...

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Abstract

The invention provides a method and an apparatus for scribing a brittle material substrate where a scribing trench can be effectively created both in the resin layer and the brittle material plate from the same side. A cut trench 22 is created in a resin layer 21 from the top by means of a fixed blade 1 or a laser beam, and then the brittle material plate is scribed along the above described cut trench 22 with a cutter wheel 2 having inclining surfaces with two angles on the two sides of the blade, and thus, a scribing trench 23 is created in the brittle material plate. The above described cutter wheel 2 is provided with a blade 2a for scribing a brittle material having a large angle +- between the ridge lines in the edge portion and second inclining surfaces 2c which continue from the first inclining surfaces 2b on the left and right of the blade 2a for scribing a brittle material so that the angle Beta at which the virtual lines along the left and right second inclining surfaces cross is smaller than the angle alpha between the ridge lines in the above described edge portion, and thus, the two sides of the blade have inclining surfaces with two angles in the structure.

Description

technical field [0001] The present invention relates to a processing method and processing apparatus for a brittle material substrate such as a glass substrate provided with a resin layer such as a film on the surface of a brittle material (glass, ceramics, semiconductor material, etc.) such as a touch panel or glass with a protective film. Background technique [0002] In the past, as a method of breaking the glass substrate, the glass substrate was fixed on the platform with a vacuum suction mechanism, and a scribe groove was formed on one side of the glass substrate by a glass cutter wheel with a large blade ridgeline angle, and then passed through a breaking rod. , Rolling rollers and other pressing means pressurize along the scribe groove, so that the vertical cracks are stretched and the glass substrate is broken. [0003] Currently, a glass substrate such as a touch substrate in which a resin layer such as a film is formed on one surface of a glass plate is widely kno...

Claims

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Application Information

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IPC IPC(8): C03B33/02
CPCC03B33/107B28D1/226C03B33/074B28D5/0011
Inventor 前川和哉阪口良太
Owner MITSUBOSHI DIAMOND IND CO LTD
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