Copper plated organic coating preparation for preventing copper surface from oxidation

Abstract

The invention discloses a copper plated organic coating preparation for preventing copper surface from oxidation, comprising the following components by mass: 12-18% of glacial acetic acid, 0.0010-0.0018% of copper sulfate, 0.052-0.056% of zinc acetate, 0.18-0.42% of ammonia water, 0.15-0.25% of benzotriazole and the balance purified water, wherein the glacial acetic acid provides the acid environment and serves as the solvent of benzotriazole; the copper sulfate promotes organic bond synthesis of benzotriazole on the new copper surface; the zinc acetate serves as a stabilizing agent and can ensure uniform and constant ultrathin coating to be formed on the copper surface; the ammonia water is used for adjusting the pH value of the solution and complexing metal ions; and benzotriazole is the main agent of the organic coating and provides the main source of the organic coating. The invention can generate the organic coating with benzotriazole as the body and can effectively prevent the copper surface of the PCB from oxidation. The coating has strong water resistance but is not resistant to acid and alkali, can be easily cleaned in the acid and alkali liquor and reduces the harms to the environment and human bodies.

Description

【Technical field】 [0001] The invention relates to an anti-oxidation technology for copper surfaces of printed circuit boards, in particular to an anti-oxidation organic film preparation for copper surfaces after copper plating. 【Background technique】 [0002] The PCB (abbreviation for Printed Circuie Board, Chinese abbreviation for printed circuit board) itself is made of insulating and heat-insulating materials that are not easy to bend. The small circuit material that can be seen on the surface is copper foil. Originally, the copper foil covered the entire substrate, but part of it was etched away during the manufacturing process, and the remaining part became a network of small circuits. , this kind of exposed copper foil circuit is very easy to oxidize. Due to the inconsistency in the production process of the PCB board and the plug-in installation process in time, it is even said that some processing processes are not completed by the same factory. Changes in environme...

AI Technical Summary

Problems solved by technology

The thickness of the organic film is 0.2-0.5um. Benzotriazole is used as the main agent of the organic film, and methanol is used as the organic solvent. This organic film is extremely volatile and will cause harm to the surrounding environment and the health of construction personnel. ; The organic film is too thick and unstable to be difficult to control; the anti-oxidation time is short, not more than 72 hours; and it is extremely resistant to acid and alkali solvents, which is not conducive to the subsequent operation of washing off the organic film