High-temperature resistant insulated thermally conductive paint with low expansion coefficient

Abstract

The invention relates to a high-temperature resistant insulated thermally conductive paint with a low expansion coefficient. The paint is characterized in that shell powder is used to provide the high-temperature resistance and the insulating property, cubic boron nitride is used to provide the thermal conductivity and the insulating property, molybdenum disulfide is used to fill in the gas holes, high-temperature resistant resin is used to provide the high-temperature resistance and the binding property; and the thermally conductive paint comprises the following components by weight percent: 25-45% of shell powder, 30-50% of high-temperature resistant resin, 1-10% of cubic boron nitride, 1-5% of molybdenum disulfide, 0-5% of curing agent and 1-5% of diluent. The raw material shell powder of the insulated thermally conductive paint has wide resources and low price, thus reducing the cost of the insulated thermally conductive paint; the product has good thermal conductivity, the coefficient of thermal conduction is more than 8W / m.K, the expansion coefficient is less than 5*10<-6> / K; the paint can be sprayed, coated or soaked on the surface of an electronic circuit substrate; and the paint can satisfy the high-temperature resistant, insulating and thermally conductive demands of the electronic circuit substrate.

Description

technical field [0001] The invention relates to a low-expansion coefficient high-temperature-resistant insulating heat-conducting paint, in particular to a low-expansion coefficient high-temperature-resistant insulating heat-conducting paint applied to an electronic circuit board substrate. Background technique [0002] With the continuous development of miniaturization, miniaturization and integration technology of electronic components, the number of components contained in each integrated circuit exceeds 250,000. With the continuous development of microelectronic technologies such as high-speed integrated circuits (VHSIC), the assembly of microelectronic devices and equipment will cause heat to diffuse and produce relatively extreme temperatures. [0003] Studies have shown that the heat flux density at the chip level is as high as 100W / cm 2 , which is only two orders of magnitude lower than the heat flux on the surface of the sun. The temperature on the surface of the s...

AI Technical Summary

Problems solved by technology

[0005] Traditional electronic circuit boards are difficult to provide heat dissipation for high heat components