Diamond chamfering polishing wheel for glass and preparation method thereof
A diamond and polishing wheel technology, applied in the field of polishing wheels, can solve the problems of low comprehensive performance and price ratio, slow chamfering and chamfering line speed, and long downtime for grinding wheel replacement, so as to save downtime for grinding wheel replacement and fast line speed. , the effect of small motor current
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no. 1 example
[0017] See figure 1 , The diamond chamfering polishing wheel for glass includes a substrate 1 and an abrasive layer 2. The abrasive layer 2 is prepared from the following volume percentages of raw materials: 10-15% of diamond with 800 mesh or more, 10-15% of silicon carbide with 600 mesh, 55-65% of polyimide resin powder over 500 mesh, 5-10% of copper powder of 325 mesh, 5-10% of silicon carbide over 1000 mesh.
[0018] The abrasive layer 2 in this embodiment is prepared from the following volume percentages of raw materials: 800 mesh diamond 10%, 600 mesh silicon carbide 15%, 500 mesh or more polyimide resin powder 60%, 325 mesh copper powder 10% , 5% of silicon carbide above 1000 mesh.
[0019] The preparation of diamond chamfering polishing wheel for glass includes the following steps:
[0020] In the first step, the above raw materials are mixed uniformly in proportion to obtain a mixture;
[0021] In the second step, the above-mentioned mixture is put into the mold and hot-pres...
no. 2 example
[0026] The abrasive layer 2 in this embodiment is prepared from the following volume percentages of raw materials: 800 mesh diamond 12%, 600 mesh silicon carbide 13%, 500 mesh or more polyimide resin powder 55%, 325 mesh copper powder 10% , 10% of silicon carbide above 1000 mesh.
[0027] See the first embodiment for the remaining unmentioned parts, and will not be repeated.
no. 3 example
[0029] The abrasive layer 2 in this embodiment is prepared from the following volume percentages of raw materials: 800 mesh diamond 15%, 600 mesh silicon carbide 10%, 500 mesh or more polyimide resin powder 65%, 325 mesh copper powder 5% , 5% of silicon carbide above 1000 mesh.
[0030] See the first embodiment for the remaining unmentioned parts, and will not be repeated.
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