Compliant multilayered thermally-conductive interface assemblies and memory modules including the same

Abstract

A thermally-conductive interface assembly is suitable for dissipating heat from a memory module or other components. Thermal interface material is disposed on or along one side of a flexible thermally-conductive sheet. The thermally-conductive sheet can be bonded to, encapsulated within, or sandwiched between first and second layers of the thermal interface material. The thermally-conductive sheet may be a flexible perforated graphite sheet. The thermal interface material may be thermally-conductive polymer. The perforations in the graphite sheet may enable a polymer-to-polymer bond to form that may help mechanically bond the first and second layers to the graphite sheet and / or may help provide heat conduction between the first and second layers. The thermally-conductive interface assembly may include flexible thermal discharge material having a first side, a second side and perforations, and may be sandwiched between the first and second layers of the thermal interface material. Part of the thermal interface material may be disposed in the perforations. The thermally-conductive interface assembly may be positioned with respect to the components, so as to provide a thermally-conductive path from the components to the first layer of the thermal interface material.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of and priority to US Patent Application 12 / 486,456, filed June 17, 2009, and US Patent Application 12 / 486,472, filed June 17, 2009. The entire disclosure of the above application is hereby incorporated by reference. technical field [0003] The present disclosure generally relates to compliant multilayer thermal interface materials and assemblies for forming thermally conductive thermal paths from heat generating components to heat dissipating components or heat sinks, and to memory modules incorporating the same. Background technique [0004] This section provides background information related to the present disclosure which is not necessarily prior art. [0005] Electronic components such as semiconductors, transistors, etc. generally have a preset temperature at which the electronic components operate optimally. Ideally, the preset temperature is close to the temperature of th...

AI Technical Summary

Problems solved by technology

This excessive temperature may adversely affect the operating characteristics, life and / or reliability of electronic components and the operation of related devices

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