Preparation method of laser diode packaging case

Abstract

The invention discloses a preparation method of a laser diode packaging case, which comprises the following steps of: cleaning before sintering, and sintering, fusing and sealing a diode seat; fixing the form of a product; electroplating, and pretreating a diode cap for sintering; sintering, fusing and sealing a diode cap, and plating the bell-shaped round metal case; and assembling the diode cap and the diode seat to form the laser diode packaging case, and the like. Because a bottom plate is processed by adopting a powder metallurgy injection forming mode, the accuracy and the positioning of a metal boss on the bottom plate can be strictly controlled by adopting the casting insert polishing technology in powder metallurgy, and mass production can be realized without die trimming. The positioning processing accuracy, the verticality and the glossiness of the centre line of the metal boss on the bottom plate from the metal bottom plate are high, and the requirements of the product can be met completely.

Description

technical field [0001] The invention relates to a packaging method of a light-emitting element, in particular to a preparation method of a laser diode packaging shell. Background technique [0002] Laser diodes have developed rapidly in the past two decades, and are widely used in optical storage and optical communications, such as the light source of the read-write head, or the transmission light source of the optical fiber network, as well as other supplies in the fields of national defense, people's livelihood, and experiments. Such as laser list machine, plate making, code reading, micro image generation, quality control and robot vision, etc. When semiconductor laser diodes are used, in order to prevent the external environment from affecting the quality of light emission, it is necessary to package the laser diodes with chips. Conventional laser diode casing packaging tube sockets (such as figure 1 As shown) is composed of a metal base 1', a metal boss 2', a flat lea...

AI Technical Summary

Problems solved by technology

Since the metal boss 2' on the metal bottom plate 1' is processed by stamping and forming the metal bottom plate, the positioning processing accuracy, verticality and smoothness of the metal boss 2' on the bottom plate 1 from the center line of the metal bottom plate require stamping processing difficulty. It is very large, and the distance between the hole and the protrusion is relatively close, and it is difficult to realize it by stamping. The stamping method cannot meet the quality required by the product, and it is difficult to achieve mass production.

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