Anti-vibration device and preparation method thereof

Abstract

The invention relates to an anti-vibration device and a preparation method thereof, and the device comprises a basal body and a device carrier, wherein an anti-vibration platform and a plurality of anti-vibration cantilever beams are arranged on the upper surface of the basal body, one end of each anti-vibration cantilever beam is fixedly connected with the anti-vibration platform and each anti-vibration cantilever beam extends in a manner of being not in contact with the upper surface of the basal body; and the upper surface of the device carrier is used for carrying a device to be protected, a groove is arranged on the lower surface of the device carrier, the device carrier is connected with the anti-vibration cantilever beams, and the groove is not in contact with the anti-vibration platform. The anti-vibration device and the preparation method thereof are applicable to applications of microelectronic circuit chips and MEMS movable devices in protection and the like under vibrationenvironment, and have very strong applicability; the anti-vibration device uses the physical way to realize the anti-vibration function, thereby being unnecessary to use a high-precision control circuit and further reducing the system cost. The preparation method can adopt the conventional MEMS process equipment and realize the mass manufacture; furthermore, the process flow is simple, and the preparation method can be compatible with a variety of types of MEMS device processes, thereby being used for realizing a microelectronic system with more extensive and more powerful functions.

Description

technical field [0001] The invention relates to the technical field of microelectronic circuit chips and microelectromechanical systems (Micro ElectroMechanical systems, MEMS) movable devices, in particular to an anti-seismic device and a preparation method thereof. Background technique [0002] In recent years, with the increasing improvement of semiconductor processing technology, MEMS has developed rapidly, especially the application of optical MEMS with the characteristics of high performance, high integration and high intelligence has become increasingly active, gradually covering all-optical communication, image display, inertial detection , infrared sensors, image detectors, biological detection and other important fields. [0003] In optical MEMS devices, high-precision key components play a vital role in the precise mechanical movement of light. At present, optical MEMS devices require the motion accuracy of key components to reach the micron / submicron level, or ev...

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Problems solved by technology

For another example, the transient disturbance can cause the micromirror to vibrate, and the position of the micromirror is one of the decisive factors for the accurate orientation of the beam propagation. Therefore, the detection, propagation, and processing of the optical signal in the device will be seriously affected. Even signal flipping and misoperation occur

Especially, when the micromirror works near the critical angle, the transient disturbance is more likely to cause the "pull-in" effect and lead to the failure of the device

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