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Chemical mechanical polishing device, polishing method and system for wafer

A chemical machinery and grinding method technology, applied in electrical components, grinding devices, grinding machine tools, etc., can solve the problems of general products and methods without suitable structures and methods, inconvenience, etc., to reduce chemical reaction time, reduce use, reduce The effect of wafer bending

Inactive Publication Date: 2013-03-27
TAIWAN SEMICON MFG CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0009] This shows that the above-mentioned existing chemical mechanical polishing process obviously still has inconvenience and defects in method and use, and needs to be further improved urgently
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

Method used

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  • Chemical mechanical polishing device, polishing method and system for wafer
  • Chemical mechanical polishing device, polishing method and system for wafer
  • Chemical mechanical polishing device, polishing method and system for wafer

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Embodiment Construction

[0076] In order to further illustrate the technical means and effects that the present invention adopts for reaching the intended invention purpose, below in conjunction with the accompanying drawings and preferred embodiments, the chemical mechanical polishing element, the polishing method of the wafer and the wafer polishing system proposed according to the present invention will be described. ) Its specific implementation, structure, method, step, feature and effect thereof are described in detail as follows.

[0077] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. For convenience of description, in the following embodiments, the same elements are denoted by the same numbers.

[0078] The present invention relates to a semiconductor substrate polishing apparatus, and in many embodiments, more particularly to ...

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Abstract

A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad operable to contact the wafer while the polishing pad is rotating, and a slurry coating system providing a slurry to the polishing pad for polishing the wafer.

Description

technical field [0001] The present invention relates to a semiconductor substrate grinding equipment, in particular to a chemical mechanical polishing (CMP) equipment, a chemical mechanical grinding element capable of performing a face-up wafer chemical mechanical grinding process, a wafer grinding method and a wafer grinding system. Background technique [0002] The semiconductor integrated circuit industry has experienced rapid growth. Technological advances in integrated circuit materials and design have produced generations, each generation having smaller and more complex circuits than the previous generation. However, these advances have increased the complexity of processing and manufacturing integrated circuits, and to realize these advances, similar developments in integrated circuit processing and manufacturing systems are required. [0003] During the development of integrated circuits, functional density (ie, the number of interconnected elements per wafer area)...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/04B24B37/005B24B57/02B24B53/017B24B55/00H01L21/00H01L21/306
CPCB24B57/02B24B53/017H01L21/02052B24B37/107
Inventor 林俞良黄见翎汪青蓉余振华
Owner TAIWAN SEMICON MFG CO LTD
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