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Gradient type anisotropic conductive film and manufacturing method thereof

A technology of anisotropic conductive adhesive and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problems of increasing manufacturing cost, increasing the amount of conductive particles added, unfavorable market competition, etc., to avoid lateral conduction pass, improve the good rate, and increase the effect of particle capture rate

Active Publication Date: 2010-11-03
ULTRA -PAK INDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If it is prepared by the traditional preparation method, it is necessary to increase the amount of conductive particles added, which will increase the manufacturing cost, which is not conducive to market competition

Method used

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  • Gradient type anisotropic conductive film and manufacturing method thereof
  • Gradient type anisotropic conductive film and manufacturing method thereof
  • Gradient type anisotropic conductive film and manufacturing method thereof

Examples

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Embodiment Construction

[0041] The implementation of the present invention will be described in more detail below in conjunction with the accompanying drawings, so that those skilled in the art can implement it after studying this specification.

[0042] like figure 1 Shown is a schematic diagram of the gradient anisotropic conductive adhesive film of the present invention. The gradient anisotropic conductive adhesive film 10 of the present invention includes a plurality of adhesive material layers, such as a first adhesive material layer 21, a second adhesive material layer 22 and a third adhesive material layer 23, each adhesive material layer It has insulating glue 30 and conductive particles 40, and the density of conductive particles 40 changes from low to high, that is, the density of conductive particles in the first glue material layer 21 is lower than the density of conductive particles in the second glue material layer 22, while the density of conductive particles in the second glue materia...

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PUM

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Abstract

The invention discloses a gradient type anisotropic conductive film and a manufacturing method thereof. The gradient type anisotropic conductive film comprises a plurality of adhesive material layers, and each adhesive material layer has different conducting particle densities. The manufacturing method comprises the following steps of: firstly manufacturing the adhesive material layers with different conducting particle densities, and then assembling the adhesive material layers in a stack mode; or firstly coating raw adhesive material layers to which no conducting particles are added, then spraying the conducting particles to be embedded into the raw adhesive material layers in an ink jet method to form the adhesive material layers, repeating the step and changing ink jet pressure so as to form the multi-layered gradient type anisotropic conductive film. The manufacturing method not only reduces the addition quantity of the conducting particles, but also increases particle capture rate and excellent product rate.

Description

technical field [0001] The invention relates to an anisotropic conductive adhesive film and a manufacturing method thereof, in particular to a gradient-type anisotropic conductive adhesive film with a multi-layer stack arrangement with different conductive particle densities and a manufacturing method thereof. Background technique [0002] Due to the thin film transistor liquid crystal display (Thin Film Transistor Liquid Crystal Display, TFT-LCD) has the advantages of light, small and low power consumption, it is currently the most important display device for personal computers and notebook computers, while consumer TFT-LCD TV sets are also increasing year by year. TFT-LCD needs a specific driving device, which is generally called LCD driving integrated circuit (Integrated Circuit, IC). The pitch of the gold bump is generally small, about 20 microns to 40 microns, and the melting point of the gold bump is much higher than that of the tin-lead bump, so it is difficult to u...

Claims

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Application Information

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IPC IPC(8): H01L23/48H01L21/60G02F1/13
CPCH01L24/29H01L2224/83101H01L2924/07802H01L2924/14
Inventor 张文耀鄞盟松
Owner ULTRA -PAK INDS
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