Frame type direct copper-ceramic bonding plate and manufacturing method thereof

Abstract

The invention discloses a frame type direct copper-ceramic bonding plate and a manufacturing method thereof. The frame type direct copper-ceramic bonding plate comprises a ceramic substrate and a ceramic frame; the ceramic frame is covered on the ceramic substrate, provided with a copper layer with preset patterns and a bottom surface, and bonded with the copper layer. The manufacturing method ofthe frame type direct copper-ceramic bonding plate comprises the following steps of: firstly, etching the copper layer to form a preset pattern with a plurality of positioning grooves on the ceramic substrate of which the surface is bonded with the copper layer; secondly, forming positioning projections corresponding to the positioning grooves at the bottom of the ceramic frame, and arranging theceramic frame on the ceramic substrate; thirdly, positioning the ceramic frame by the positioning projections and the positioning grooves, thermally treating the ceramic frame, directly bonding the ceramic frame and the copper layer to fix the ceramic frame on the ceramic substrate. Thus, the invention has no need of using an adhesive and avoids the ageing and the deterioration of the adhesive, so that the bonding performance and the sealing performance of the ceramic frame and the ceramic substrate are more stable.

Description

technical field [0001] The invention relates to a frame-type ceramic copper-clad board and a manufacturing method thereof, in particular to a frame-type ceramic copper-clad board in which a ceramic frame is directly bonded on a copper-clad ceramic substrate and a manufacturing method thereof. Background technique [0002] In order to prevent the electronic components from being affected by moisture or contamination and affect their electrical functions, the electronic components need to be packaged for protection, especially semiconductor components, such as light-emitting diodes (LEDs), which are usually packaged to increase their service life. [0003] refer to figure 1 , a common LED packaging structure, a frame 92 is provided on a substrate 91 to house a chip (not shown), and a lens 93 is covered to seal the chip therein. Generally, the substrate 91 can be a ceramic board on which circuit patterns are provided for electrical connection of chips. The frame body 92 can b...

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Problems solved by technology

[0004] The problem to be solved by the present invention is the problem of aging and deterioration of the bonding agent caused by the fixing of the ceramic frame by the bonding agent, and the problem that the installation procedure is complicated because the metal frame must be insulated.

[0005] The means of the present invention to solve the above-mentioned problems is to directly fix a ceramic frame on a copper-clad ceramic substrate by thermal bonding, thereby avoiding the use of bonding agent and solving the problem that the bonding agent is easy to age and deteriorate. Moreover, Compared with the metal frame, the self-insulating ceramic frame does not need to consider the problem of short circuit, which makes the installation process easier

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