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Production process of metallized semi-pore

A technology of metallized half-hole and manufacturing process, which is applied in the field of PCB manufacturing, can solve the problems of PCB board yield decline, increase of enterprise cost, poor burr and peak short circuit, etc., and achieve the effect of stable quality, simple process and high yield rate

Inactive Publication Date: 2010-10-06
惠州威健电路板实业有限公司
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  • Summary
  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

However, in the removal operation, due to the hollowness of the round hole, the copper on the hole wall will bend inwards to produce metal wires when subjected to external forces, resulting in burrs and peaks that cause short circuits, which eventually lead to a decline in the yield of PCB boards and increase the number of enterprises. cost

Method used

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Embodiment Construction

[0014] In order to facilitate the understanding of those skilled in the art, the principle of the present invention will be further described in detail below in conjunction with specific embodiments.

[0015] The production process of the metallized half-hole is: substrate drilling → copper sinking on the hole wall → pattern transfer → pattern electroplating → removal of the metallized half-hole on the PCB → alkaline etching → film removal → secondary alkaline etching → Fade tin.

[0016] In the process of PCB board production, firstly, holes are drilled on the substrate, and then copper is deposited in the holes, graphics are transferred, and graphics are electroplated. During the electroplating process, tin is plated on the board to protect the copper that needs to be retained during etching. After etching Then strip off the tin on the circuit to reveal the required circuit pattern.

[0017] The manufacturing process of the metallized half hole of the PCB board is mainly to...

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Abstract

The invention relates to the field of PCB manufacturing, in particular to a production process of a metallized semi-pore on a PCB board, which comprises the following steps: 1) substrate drilling, copper plating, pattern transfer, pattern plating and routing of a round pore into a semi-pore according to design needs; 2) alkaline etching of a PCB board; 3) stripping; 4) secondary alkaline etching; and 5) tin removal. The horizontal moving speed of the routing machine in Step (1) is 0.2-0.5m / min, and the number of stacked plates is 2pnl / gong. The invention adopts the method of alkaline etching without membrane stripping to etch copper burrs produced in routing of the semi-pore, and the other parts of the board surface can not be affected by etching due to dry membrane protection; and then normal membrane stripping, etching (secondary etching) and tin stripping are carried out, thereby ensuring the high quality of the metallized semi-pore.

Description

technical field [0001] The invention relates to the field of PCB manufacturing, in particular to a manufacturing process of a metallized half hole on a PCB. Background technique [0002] There is a sub-mother board in the PCB industry. Generally, the sub-board is used to mount chips. The sub-board after the chip is mounted is used as a component (similar to an IC chip) and then mounted on the motherboard. On this sub-board, a metallized half-hole needs to be processed, and the chip pins are fixed in the metallized half-hole and welded together on the mother board. This kind of daughter board is widely used in car audio, computer, camera, etc., with small size and good performance. [0003] In the production of this type of circuit board, a round hole is generally drilled on the board first, and the round hole is subjected to processes such as copper sinking, pattern plating, film removal, and etching, and then the round hole is cut in half to make a half hole. However, in ...

Claims

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Application Information

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IPC IPC(8): H05K3/42
Inventor 赵志平周刚刘保光
Owner 惠州威健电路板实业有限公司
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