Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Bionic micro/nano structure preparing method

A technology of micro-nano structure and nano-structure, applied in the field of bionic micro-nano structure preparation, can solve the problems of difficulty in preparing a complete structure, expensive equipment, slow processing speed, etc., and achieve the effect of promoting preparation and application and low cost

Inactive Publication Date: 2010-09-08
HUAZHONG UNIV OF SCI & TECH
View PDF7 Cites 33 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, for the typical complex biomimetic structure combining micro-nano (scale changes from tens of nanometers to hundreds of microns), it is difficult to prepare a complete structure by conventional processes
The current research, or directly using biological templates combined with atomic layer deposition (ALD, Atomic Layer Deposition), or using FIB (Focused Ion Beam) processing, etc., the equipment is expensive, the processing speed is slow, the efficiency is low, and the cost is too high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bionic micro/nano structure preparing method
  • Bionic micro/nano structure preparing method
  • Bionic micro/nano structure preparing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Example 1. Preparation of micro-nano structure on the surface of imitating butterfly phosphor wings.

[0021] The embodiment 1 of the present invention is used to prepare the micro-nano structure on the surface of imitating butterfly phosphor wings. figure 1 . A layer of SiO is thermally grown on the surface of Si substrate 2 , Using photolithography technology to transfer the micro-scale pattern on the mask to the spin-coated photoresist surface, and put the exposed film into the developer to dissolve the unnecessary photoresist to obtain the required etching The pattern with resist protection is further used RIE dry etching to transfer the pattern to SiO 2 . Using ICP deep etching, a periodic or quasi-periodic micro-scale structure is obtained, and the sidewall must retain sufficient corrugation depth during ICP etching. Then, an electron beam evaporation process is used to evaporate the nano-structure growth seed obliquely, and then grow the nano-structure directionall...

Embodiment 2

[0030] Example 2. Preparation of the micro-nano structure on the surface of the imitation gecko foot.

[0031] Example 2 of the present invention is used to prepare the micro-nano structure on the surface of the imitation gecko foot. figure 2 . A layer of SiO is thermally grown on the surface of Si substrate 2 , Using photolithography technology to transfer the micro-scale pattern on the mask to the spin-coated photoresist surface, and put the exposed film into the developer to dissolve the unnecessary photoresist to obtain the required etching The pattern with resist protection is further used RIE dry etching to transfer the pattern to SiO 2 . Using ICP deep etching, micro-scale structures with periodic / quasi-periodic distribution are obtained. Then, the electron beam evaporation process is used to evaporate the nanostructure growth seeds on the top of the microscale structure, and then the nanostructures are grown directionally to obtain the micro-nano structure on the surfa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a bionic micro / nano structure preparing method by combining top-down and bottom-up modes, which comprises the following steps of: firstly, preparing a microscale structure serving as a substrate by the top-down method which mainly comprises film growing, photoetching, dry etching and the like; secondly, selectively performing evaporative deposition on seeds for growing a nano structure on the top or the side wall of the microscale substrate; thirdly, growing the direction controllable nano structure from the seeds by the bottom-up method; and finally, preparing the hierarchical layering period / standard period bionic micro / nano structure with excellent characteristics, such as gecko seta-simulated micro / nano structure, morpho lepidoptera-simulated micro / nano structure and the like. The method is an integrated preparation method by combining the top-down and bottom-up preparation processes, has the characteristics of high efficiency and low cost, is suitable for massive large-area production and is a new effective way for massive preparation and application of the bionic micro / nano structure.

Description

Technical field: [0001] The invention belongs to the field of micro-nano processing, and specifically relates to a method for preparing a bionic micro-nano structure combining top-down and bottom-up, and is suitable for high-efficiency and low-cost mass production of biomimetic micro-nano structures such as butterfly phosphor wings , Imitate the micro-nano structure of gecko feet, and promote the preparation and application of bionic micro-nano structures. Background technique: [0002] After the natural selection of "survival of the fittest" and hundreds of millions of years of evolution, the surface of natural organisms has shown a variety of functions and formed many unique structures and excellent characteristics. Studies have found that the unique functions of organisms are closely related to the surface, especially the surface microstructure, and the surface microstructure shows a certain rule, which is determined by the basic structure of micro and nano It is arranged reg...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B81C1/00B82B3/00
Inventor 廖广兰王中林彭争春史铁林高阳
Owner HUAZHONG UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products