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Manufacturing method for microwave high frequency metal base circuit board

A technology of high-frequency metal and production method, which is applied in the direction of printed circuit manufacturing, printed circuit, metal processing equipment, etc., can solve the problem of material characteristics of metal-based polytetrafluoroethylene that are not suitable for microwave high-frequency, affect the signal transmission performance of the client, and board Eliminate problems such as edge and aperture deformation, and achieve the effect of smooth milling edges, improved manufacturing accuracy, and stable performance

Inactive Publication Date: 2010-07-21
施吉连
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Problems solved by technology

However, the current production method of microwave high-frequency metal-based circuit boards still follows the manufacturing method and process of ordinary epoxy resin metal-based circuit boards, but it is not suitable for the characteristics of microwave high-frequency metal-based PTFE materials. It is easy to cause deformation and blackening, which will affect the signal transmission performance of client products

Method used

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  • Manufacturing method for microwave high frequency metal base circuit board
  • Manufacturing method for microwave high frequency metal base circuit board

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Embodiment Construction

[0008] exist figure 1 Among them, the present invention is a method for making a microwave high-frequency metal-based circuit board, which includes the following steps: Step 1, making a photo-painting template: firstly, the template is used for graphic design, and the designed graphic is designed according to the production process parameters. Process the engineering files to make them meet the production and processing requirements, then imposition the processed files, and then use a high-precision laser photoplotter with a resolution of 10160dpi to make black negatives, rinse the photopainted negatives, and then develop, Fixing, cleaning, and air-drying; then use a 100× microscope to inspect the negative film, and finally take the negative film as the mother, copy the brown film with a 3KW exposure machine, and inspect the copied brown film; Step 2, open the material and drill holes Production: First, use an electric shearing machine to cut out the required microwave high-fr...

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Abstract

The invention discloses a manufacturing method for a microwave high frequency metal base circuit board, which comprises the following steps: step one, manufacturing an optical drawing template; step two, manufacturing a split material and a bore hole; step three, manufacturing the surface graph of a composition board of a metal base copper-clad plate; step four, electroplating and etching; and step five, molding. Not only the manufacturing method has high manufacturing precision and effectively increases the product quality and working efficiency, but also the manufactured microwave high frequency metal base circuit board has stable performance.

Description

technical field [0001] The invention relates to a manufacturing method of a microwave high-frequency metal base circuit board. Background technique [0002] With the development of electronic products in the direction of miniaturization, high frequency, digitization, and high reliability, microwave high-frequency metal-based circuit boards have the excellent high heat resistance, high heat dissipation, and excellent size of ordinary metal-based circuit boards. In addition to stability, it is more high frequency, high microwave, and the insulating medium layer has good strength and flexibility and high breakdown voltage resistance. However, the current production method of microwave high-frequency metal-based circuit boards still follows the manufacturing method and process of ordinary epoxy resin metal-based circuit boards, but it is not suitable for the characteristics of microwave high-frequency metal-based PTFE materials, and its board edges and apertures It is easy to c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/18H05K3/26B23C3/00B23C5/00B23B51/00B23B49/00
Inventor 施吉连
Owner 施吉连
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