Multispectral sensitization device and manufacturing method thereof

Abstract

The invention relates to a multispectral sensitization device and a manufacturing method thereof. The device comprises at least one non-transparent basement layer, each basement layer is composed of at least two surfaces, each surface is provided with sensitization pixel groups which are used for inducing light of optional spectrum coming from the positive direction of the surfaces where the sensitization pixel groups are located; or the device comprises at least one transparent basement layer, each basement layer is composed of at least two surfaces, each surface is provided with sensitization pixel groups which are used for inducing light of optional spectrum coming from the positive side or the reverse side of the surfaces where the sensitization pixel groups are located. In the invention, bidirectional sensitization can be realized through a same device, different scenes in two different directions can be induced; in addition, the device can be used for unidirectional sensitization to improve properties of the sensitization device.

Description

technical field [0001] The invention relates to a multi-spectrum photosensitive device and a manufacturing method thereof. More precisely, the present invention relates to a photosensitive device for full-color images capable of simultaneously sensing multiple spectrums (such as visible light and infrared light) and a fabrication method thereof. Here, panchromatic refers to the entire spectrum of interest. For ordinary (visible light) photosensitive devices, panchromatic refers to covering the entire visible spectrum of red, green, blue and white. For photosensitive devices that combine infrared and color, panchromatic refers to the visible spectrum and the infrared spectrum. The invention is applicable to multispectral photosensitive devices including black and white and color images. Background technique [0002] The traditional technology of designing and manufacturing color image photosensitive chips (or devices) either uses single-layer photosensitive pixels or three...

AI Technical Summary

Problems solved by technology

[0005] As mentioned above, there are three common difficulties in realizing the filter film technology by composite color (green, yellow, peach and green) patterns, Bayeux patterns, or honeycomb patterns: The first difficulty is the reduction in sensitivity caused by the filter film (relative to black and white sensor chip)

The second difficulty is the reduction in effective sharpness (or resolution) due to color interpolation

For a single-layer photosensitive chip, it has encountered a bottleneck in sensitivity, and its space and energy usage efficiency is not as good as that of a multi-layer chip.

For multi-layer (two-layer or three-layer) photosensitive chips, the processing complexity is naturally much more difficult.

Another function that the existing photosensitive chip technology does not have is that they cannot simultaneously sense the light corresponding to different scenes from the front and back directions.

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