Preparation method of large-diameter composite insulator solid core rod
A composite insulator and large-diameter technology, which is used in the field of preparation of large-diameter composite insulator solid mandrels, can solve the problems of unmoving pultrusion, damage to the mold, slow speed, etc. Effect
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Embodiment 1
[0030] A method for preparing the secondary winding of a large-diameter composite insulator solid mandrel is carried out according to the following steps:
[0031] 1) According to customer requirements, the diameter of the solid pultruded insulating mandrel is ≤130mm;
[0032] 2) Roughen the outer surface of the solid mandrel to facilitate bonding with the secondary winding part, and the roughness is
[0033] 3) Scrub the outer surface of the processed solid mandrel with acetone and put it in an oven at a constant temperature of 40°C for 30 minutes;
[0034] 4), the outer surface of the solid mandrel is coated with 2% KH560 absolute ethanol solution, and then put into the oven for 40
[0035] ℃ constant temperature for 1 hour;
[0036] 5), the configuration of the resin glue: the composition ratio of the resin glue is E44 epoxy resin: modified imidazole curing agent: toughening agent: active silica powder = 90~110: 90~110: 9~11: 5~10; The curing agent is methyl tetraphtha...
Embodiment 2
[0042] A method for preparing the secondary winding of a large-diameter composite insulator solid mandrel is carried out according to the following steps:
[0043] 1) According to customer requirements, the diameter of the solid pultruded insulating mandrel is 120mm;
[0044] 2) Roughen the outer surface of the solid mandrel to facilitate bonding with the secondary winding part, and the roughness is
[0045] 3) Scrub the outer surface of the processed solid mandrel with acetone and put it in an oven at a constant temperature of 40°C for 30 minutes;
[0046] 4) The outer surface of the solid mandrel is then coated with 2% KH560 absolute ethanol solution, and then placed in an oven at a constant temperature of 40°C for 1 hour;
[0047] 5), the configuration of the resin glue: the composition ratio of the resin glue is E44 epoxy resin: modified imidazole curing agent: toughening agent: active silica powder = 90~110: 90~110: 9~11: 5~10; The curing agent is methyl tetraphthalic a...
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