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Temperature control method of glue dispenser

A temperature control method and glue dispenser technology, applied in electrical components, liquid injection devices, injection devices, etc., can solve problems such as affecting the glue output and affecting the processing quality of parts 4

Inactive Publication Date: 2010-06-16
黄宏岳
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] like figure 1 As shown, for each injection action of the conventional dispensing equipment, let all the syringes 2 of the same injection head 1 control their injection volume according to the same injection time or pressure, but the glue flow rate of each group of syringes 2 The glue output is controlled by the amount of air poured into the syringe 2, but when the air reciprocates in the syringe 2, the syringe 2 will be deformed due to heat, which will not only affect the normal glue output, but also The rubber material 3 inside the syringe 2 is more likely to deteriorate due to heat, which in turn affects the processing quality of the component 4

Method used

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  • Temperature control method of glue dispenser
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  • Temperature control method of glue dispenser

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Embodiment Construction

[0022] In order to make your examiner understand the main technical content and implementation mode of the present invention, the description is as follows with the help of drawings:

[0023] Such as figure 2 As shown, the dispenser used in the dispenser temperature control method of the present invention is provided with a dispensing device 10 for dispensing the tablet parts, and an input device 20 is provided for sending the tablet parts into the dispensing device 10, an output device 30 is provided to remove the material sheet parts that have completed the dispensing action from the dispensing device 10, and a control device 40 is provided to integrate and control the dispensing device 10, the input device 20 and the output device 30 operation.

[0024] The glue dispensing machine temperature control method of the present invention is mainly provided with a temperature control equipment 50 controlled by the control equipment 40, and the glue dispensing equipment 10 is coo...

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Abstract

The invention relates to a temperature control method of a glue dispenser, which is mainly characterized in that: a control device of the glue dispenser selects to control a temperature control device to continuously, intermittently or periodically carry out a cooling action on a glue dispensing device of the glue dispenser when the glue dispensing device carries out a glue dispensing action, or the control device controls the temperature control device to continuously or intermittently carry out the cooling action to the glue dispensing device of the glue dispenser when sensing the actual working temperature of the glue dispensing device raises, therefore, a needle cylinder of the glue dispensing device is controlled at a normal temperature, and the influence on the glue dispensing amount due to the thermal deformation of the needle cylinder is avoided, and the thermal deterioration of glue stuff inside the needle cylinder is prevented.

Description

technical field [0001] The invention relates to a temperature control technology of a glue dispensing machine, which is mainly used to control the temperature of the glue dispensing equipment of the glue dispensing machine, to prevent the syringe barrel of the glue dispensing equipment from being deformed by heat and affect the amount of glue injected, and to prevent the glue inside the syringe Deteriorated by heat. Background technique [0002] With the continuous advancement of electronics manufacturing technology, the speed and precision requirements of related equipment in each link of the manufacturing process are gradually increasing, and the dispensing equipment used to package electronic components also has a corresponding demand. For example, SMD-type light-emitting diodes are suitable for using automatic equipment to perform matrix-arranged parts on the material because they can be stamped into metal sheets with a plurality of "parts" that serve as SMD-type light-e...

Claims

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Application Information

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IPC IPC(8): B05B9/047B05B15/00H01L23/28H01L31/0203
Inventor 黄宏岳
Owner 黄宏岳
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