Preparation method of high-hardness Cu-SiC nanometer compound plating layer and special device thereof

Abstract

The invention discloses a preparation method of a high-hardness Cu-SiC nanometer compound plating layer and a special device thereof. The preparation method comprises the following steps of: pretreating nanometer SiC particles, preparing an electrolytic solution containing the nanometer SiC particles, primarily treating a cathode plate and carrying out electrolytic deposition for preparing the high hardness Cu-SiC nanometer compound plating layer. In the preparation method of a high-hardness Cu-SiC nanometer compound plating layer, secondary reunion of the nanometer particles can be effectively avoided, the electrolytic solution spray deposition process can be higher than the cathode current density of the common electrodeposition processes for carrying out electrolytic deposition, and therefore, high speed electrolytic deposition on unit area of the cathode surface can be realized. The nanometer composite plate prepared by the invention has the advantages of high content of nanometer particles, uniform distribution of nanometer particles, high hardness, compact crystal structure, good surface quality, and the like.

Description

technical field [0001] The invention relates to a method for preparing a nanocomposite coating, in particular to a method for preparing a high-hardness Cu-SiC nanocomposite coating and special equipment for preparing a high-hardness Cu-SiC nanocomposite coating. Background technique [0002] Composite coatings, which have developed rapidly in the past 30 years, have been widely used in engineering technology because they have many better physical and mechanical properties than single-phase materials. Using composite electrodeposition technology to co-deposit solid hard particles and matrix metals on the surface of parts to form composite coatings is one of the effective ways to improve material properties. The preparation of nanocomposites by electrodeposition is a process in which nanoparticles and metal ions to be deposited are co-deposited on the surface of the cathode using the principle of electrochemistry, and nanocomposites with certain special functions are formed. ...

AI Technical Summary

Problems solved by technology

While solving the agglomeration of nanoparticles, the chemical method also introduces other components that have a negative impact on the performance of the coating, reducing its overall performance

Physical methods can also effectively disperse nanoparticles, but due to process limitations, it is difficult to fully play their role in the entire coating preparation process

The usual practice is: use ultrasonic waves to deagglomerate the nanoparticles before plating, and do not use ultrasonic waves during electroplating, but once the ultrasonic or mechanical stirring stops, the nanoparticles will reunite and settle again, making the composite plating process difficult.

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