Copper core layer multilayer packaging substrate manufacturing method

Abstract

A copper core layer multilayer packaging substrate manufacturing method is a single surface and multilayer packaging substrate for starting manufacturing by taking the copper core substrate as a base. The structure comprises a thick copper plate with high rigidity, and one surface of the thick copper plate has a build-up circuit, while the other surface has a ball side pattern barrier. The mode for connecting its crystal providing side and ball side with various build-up circuits is that they are communicated by a plurality of electroplating blind holes and buried holes. Therefore, The inventive packaging substrate is characterized by including a high-density build-up circuits for providing the coiling required by connecting of electronic assembly, and simultaneously using a thick copper plate to provide enough rigidity to make the packaging process to be more easier. Therefore, the multilayer packaging substrate manufactured by the invention can form copper core layer multilayer packaging substrate supported by a copper core substrate, and can effectively improve plate bending problem of ultrathin nuclear layer substrate and simplify the making flow of conventional build-up circuit board, thereby achieving the object of improving the reliability when the packaging body is jointed to the substrate.

Description

Technical field: [0001] The invention relates to a manufacturing method of a copper core layer multilayer packaging substrate, in particular to a manufacturing method of a single-sided, multi-layer packaging substrate manufactured on the basis of a copper core substrate. Background technique: [0002] In the production of general multi-layer packaging substrates, the production method usually starts with a core substrate, through drilling, electroplating metal, plugging and double-sided circuit production, etc., to complete an inner core board with a double-sided structure. Then, a multi-layer package substrate is completed through a circuit build-up process. Such as Figure 22 As shown, it is a schematic cross-sectional view of a packaging substrate with a core layer. First, prepare a core substrate 60, wherein the core substrate 60 is composed of a core layer 601 with a predetermined thickness and a circuit layer 602 formed on the surface of the core layer 601, and a plurality ...

AI Technical Summary

Problems solved by technology

However, this manufacturing method is not only difficult to manufacture the copper core substrate, but also has the same disadvantages as the above method, such as low wiring density and complicated process.

Therefore, the general users cannot meet the needs of users in actual use

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