Heat dissipation module, temperature equalizing element and manufacturing method for temperature equalizing element

Abstract

The invention discloses a heat dissipation module, a temperature equalizing element and a manufacturing method for the temperature equalizing element. The manufacturing method for the temperature equalizing element comprises the following steps: providing a flat hollow tube body of which the inner wall surface is distributed with continuous first capillary structures; providing at least one guideelement which is placed in the flat hollow tube body and of which surface is provided with second capillary structures; connecting the first and second capillary structures to form continuous capillary structures; and filling a working fluid into the flat hollow tube body, and sealing two ends of the flat hollow tube body. In addition, the invention also provides the temperature equalizing elementand the heat dissipation module comprising the temperature equalizing element, wherein the heat dissipation module is provided with the temperature equalizing element which is used on a heating element. The manufacturing method for the temperature equalizing element comprises the steps of providing the flat hollow tube body of which inner wall surface is provided with the first capillary structures, placing the at least one guide element with a guide capillary structure into the flat hollow tube body, and making the first capillary structures and the guide capillary structure form the continuous capillary structures by using a sintering process. The manufacturing method for the temperature equalizing element can provide better flowing path for the working fluid in the temperature equalizing element.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module in which a flow guiding element with a capillary structure is arranged inside a hollow cavity. Background technique [0002] With the development of science and technology, the number of transistors per unit area of ​​electronic components is increasing, resulting in an increase in heat generation during use. Since a heat pipe is a simple but extremely effective heat dissipation device, it has been widely used in various electronic heat dissipation products. Its working principle is to transfer energy through the latent heat of the phase change between the gas and liquid phases of the working fluid. In the evaporation section, the working fluid takes away a large amount of heat energy from the heat source by the latent heat of evaporation and condenses into a liquid in the condensation section. And release heat energy, while the working fluid flows back to t...

AI Technical Summary

Problems solved by technology

[0003] Vapor chamber is a type of heat pipe. Traditionally, vapor chambers are mainly welded together by upper and lower plates. Not only is the welding path long and the welding reliability is low, but also the capillary structure of the upper and lower plates cannot be continuous, and can only be welded by contact. Connected in a way that causes the capillary force to drop when the working fluid passes through, hinders the return velocity and affects the heat conduction efficiency

[0004] In addition, the traditional method of welding the upper and lower plates is relatively expensive due to the large number of parts and the high level of mold and fixture technology. Due to the limitation of geometric shape, the capillary structure of the upper and lower plates needs to be individually sintered, so it is impossible to Simultaneous completion in a single step

Furthermore, with the demand for vapor chambers of different lengths, different forming molds and related processing tools need to be used correspondingly, resulting in a substantial increase in equipment costs

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