Semiconductor packaging structure
A packaging structure and semiconductor technology, used in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as reliability and yield reduction, chip cracking, mismatch, etc.
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[0013] The direction that the present invention discusses here is a packaging structure and its packaging method, which is to provide a substrate with an opening, so that the upper and lower chips are attached to the substrate in a flip-chip manner facing the opening, and then packaged. In order to provide a thorough understanding of the present invention, detailed steps and components thereof will be set forth in the following description. Obviously, the practice of the present invention is not limited to specific details of the manner in which the chips are packaged that are familiar to those skilled in the art. For the preferred embodiments of the present invention, it will be described in detail as follows, but in addition to these detailed descriptions, the present invention can also be widely implemented in other embodiments, and the scope of the present invention is not limited, and it is described in the appended The scope defined by the claims shall prevail.
[0014]...
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