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Prolate glass sealed surface mounting diode and packaging tape thereof

A technology of glass encapsulation and diodes, applied in packaging, electrical components, electric solid devices, etc., can solve the problems of poor handover, easy rolling, easy rolling and sliding, etc., and achieve the advantages of increased adsorption area, difficult suction deviation, and strong adsorption Effect

Active Publication Date: 2010-01-06
SIYANG GRANDE ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During packaging, the cross-section of the accommodating part of the packaging tape that accommodates the diode is also a square. The side length of the square is generally greater than the diameter of the cylindrical electrode, so that the diode is easy to roll in the packaging tape. When using the tape, the diode The misalignment or misalignment in the packaging tape will cause the suction nozzle and the glass body to be not firmly adsorbed, and a certain proportion of poor handover and material drop problems will occur during the handover process; or the suction nozzle may be sucked on the edge of the diode, resulting in deviation, standing, etc. an uncontrollable anomaly
At the same time, when the above-mentioned diode is on the flat plate, the circular electrode is in contact with the flat plate, and it is easy to roll and slide

Method used

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  • Prolate glass sealed surface mounting diode and packaging tape thereof
  • Prolate glass sealed surface mounting diode and packaging tape thereof
  • Prolate glass sealed surface mounting diode and packaging tape thereof

Examples

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Embodiment

[0019] Example: such as figure 1 As shown, a flat and long glass-encapsulated chip diode includes a glass body 1 and cylindrical electrodes 2 at both ends of the glass body 1, the glass body 1 is a rectangular cylinder, and the diameter d of the electrode 2 is between the glass body 1 Rectangular cross-section between length a and width b.

[0020] The central axis of the rectangular cylinder of the glass body 1 is set to coincide with the axis of the electrode 2 .

[0021] Such as Figure 2 to Figure 4 As shown, a packaging tape used in conjunction with the above-mentioned flat and long glass-encapsulated patch diodes includes a tape body 3 and a plurality of accommodating parts 4 distributed on the tape body 3 for accommodating diodes. The accommodating parts 4 have a rectangular Cylindrical inner cavity 5, the width b' of the cross section of the inner cavity 5 is greater than the diameter d of the diode electrode 2 and less than the length a of the cross section of the d...

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PUM

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Abstract

The invention discloses a prolate glass sealed surface mounting diode comprising a glass body and cylindrical electrodes at both ends of the glass body, wherein the glass body is a rectangular cylinder, and the diameter size of each electrode is between the length and the width of the rectangular cross section of the glass body. A packaging tape used by matching with the prolate glass sealed surface mounting diode comprises a tape body and a plurality of containing parts, wherein the containing parts are distributed on the tape body and are used for containing the diode, each containing part is provided with an inner cavity in the shape of the rectangular cylinder, and the width of the cross section of the inner cavity is greater than the diameter of the diode electrode and smaller than the length of the cross section of the glass body of the diode. The diode can not roll in the containing parts of the packaging tape, and can not easily roll or slide on a flat plate, thereby reducing the problems of poor cross connection and the like caused by deviation generated when the diode is mounted on a circuit board.

Description

technical field [0001] The invention relates to a flat and long glass-encapsulated chip diode and its packaging tape. Background technique [0002] The existing glass-encapsulated patch diodes include a cylindrical glass body and cylindrical electrodes at both ends of the glass body. The cross-section of the glass body is a square, and the side length of the square is smaller than the diameter of the cylindrical electrode, so that the cylindrical electrode is radially exposed outside the glass body so that Solder with the circuit board. During packaging, the cross-section of the accommodating part of the packaging tape that accommodates the diode is also a square. The side length of the square is generally greater than the diameter of the cylindrical electrode, so that the diode is easy to roll in the packaging tape. When using the tape, the diode The misalignment or misalignment in the packaging tape will cause the suction nozzle and the glass body to be not firmly adsorbe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/48H01L29/861B65D73/02
Inventor 钟运辉
Owner SIYANG GRANDE ELECTRONICS CO LTD
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