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Method of producing polyester amide hot melt adhesive

A technology of polyester amide and its manufacturing method, which is applied in the direction of adhesives, etc., can solve the problems of uncontrollable relative content and sequence distribution of ester bond and amide bond, uncertain melting range and proportion of polyester glue and polyamide glue, etc., to achieve Plump appearance quality, not easy to store, excellent dry cleaning resistance

Inactive Publication Date: 2009-11-25
陈国新
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Problems solved by technology

[0004] The purpose of the present invention is to provide a polyester amide hot-melt adhesive manufacturing method, which can effectively solve the problem that the relative content and sequence distribution of the ester bond and amide bond cannot be controlled due to the uncertain melting range and proportion of the existing polyester glue and polyamide glue. Problems affecting product performance

Method used

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  • Method of producing polyester amide hot melt adhesive

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Embodiment Construction

[0015] refer to figure 1 An embodiment of the method for producing polyester amide hot-melt adhesive of the present invention, the polyester adhesive with a melting range of 130-140°C and the polyamide adhesive with a melting range of 140-150°C are added to the reactor at a weight ratio of 1:1. Then add polyester glue and polyamide glue total weight 0.1% acetate catalyst and 0.01% phosphite antioxidant. Under the protection of nitrogen, slowly heat until the colloidal particles melt, start stirring, raise the temperature to 240-250°C and maintain for 3-4 hours to carry out chain exchange reaction. Then slowly depressurize until the melt viscosity reaches 77.3Pa·s, remove the low molecular matter in the reaction system, and when the melt viscosity reaches the requirement, fill nitrogen to normal pressure and then change to 1.08 atmospheric pressure, and press the melt material in a strip shape Put it into a water tank, cool, and cut into pellets to obtain colloidal pellets.

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Abstract

The invention discloses a method of producing polyester amide hot melt adhesive, comprising the steps as follows: adding the polyester adhesive with melting range being 130 to 140 DEG. C and polyamide adhesive being 140 to 150 DEG. C into a reaction kettle according to 1:1 weight ratio, then adding catalyst and antioxidant into the reaction kettle, slowly heating until the colloid melting under the protection of nitrogen, stirring, heating to carry out chain exchange reaction, then slowly decompressing until the melt viscosity being 72.3 to 78.3 Pa.s, filling the nitrogen to the normal pressure, then changing to 1.03 to 1.09 high atmospheric pressure to obtain melt material, pressing the melt material into sink by strip shape, cooling, cutting to obtain colloid. The invention has the advantages of effectively controlling the contents and sequence distribution of ester linkage and amido link of the colloid, solving the shortcomings that the daiamid has large dependence to the temperature, and the adhesive is easy to percolate from liner, and the absorption ratio is high and is difficult to store, and is easy to discolor under illumination.

Description

technical field [0001] The invention relates to a method for manufacturing hot-melt adhesives, in particular to a method for manufacturing polyester amide hot-melt adhesives. Background technique [0002] Polyester hot melt adhesive has high heat resistance, good weather resistance, water wash resistance and elasticity, but it is not suitable for fabric hot melt adhesive due to its high melting point, high viscosity when heated and melted, and poor dry cleaning resistance. ; Polyamide hot-melt adhesive has excellent flexibility, good aging resistance and dry cleaning resistance, low melting temperature, and is convenient for garment processing operations, but its washing resistance is poor. [0003] Polyester amide hot melt adhesive is made by mixing polyester glue and polyamide glue to obtain colloidal particles. Since polyester amide products are co-condensed with both ester bonds and amide bonds on a macromolecular chain The relative content and sequence distribution of ...

Claims

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Application Information

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IPC IPC(8): C09J177/12
Inventor 严惠莲
Owner 陈国新
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