Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and device for inspecting abnormal data

A technology of abnormal data and inspection method, which is applied in the field of abnormal data inspection, can solve problems such as complex algorithms and inapplicability to actual production, and achieve the effects of improving product yield, reducing scrap, and improving accuracy

Inactive Publication Date: 2009-11-04
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORP
View PDF1 Cites 23 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the processing of abnormal points in non-normally distributed data samples, there are currently only relevant theoretical studies, but the algorithms of these theories are too complicated to be suitable for actual production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for inspecting abnormal data
  • Method and device for inspecting abnormal data
  • Method and device for inspecting abnormal data

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0048] refer to Figure 5 , an embodiment of the statistical process control device of the present invention, comprising:

[0049] The data sample sorting unit M1 is used to sort the unfiltered data samples in order of size;

[0050] Percentile selection unit M2 for selecting the first percentile P 1 and the second percentile P 2 ;

[0051] The data screening limit calculation unit M3 is used to calculate the percentile value corresponding to said data sample and percentile, which will correspond to the first percentile P 1 and the second percentile P 2 The calculation result of the percentile of the above data sample is used as the numerical screening upper limit value and the data screening lower limit value;

[0052] A determining unit M4, configured to determine data in the data sample whose value is greater than the upper limit of numerical screening or less than the lower limit of numerical screening as abnormal data points.

[0053] In a specific implementation, t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a method for inspecting abnormal data and an inspection device applying the method. The method comprises the following steps: performing sequencing on unfiltered data samples according to the size; selecting a proper percentile in the data samples, and calculating a percentile value corresponding to the percentile; and taking the calculation result as a numerical screening limit value of the data samples, and taking data, of which the value is more than the upper limit value of numerical screening or less than the lower limit value of numerical screening, in the data samples as abnormal data points. The invention improves the inspection precision by improving the method for inspecting the abnormal data, is favorable for improving the yield of products and reducing waste plates and the production cost, realizes the inspection on abnormally distributed type data which cannot be realized in the prior art, and improves the production efficiency.

Description

technical field [0001] The invention relates to a method and device for checking abnormal data. Background technique [0002] The manufacturing process of semiconductors is very complicated, including hundreds of processes such as oxidation diffusion, photolithography, etching, washing, deposition, etc., and it is generally difficult to establish a corresponding manufacturing model. The monitoring of the semiconductor manufacturing process is usually achieved by collecting data samples of various process parameters, analyzing and monitoring these data samples. [0003] When analyzing the data samples, it is first necessary to check the collected data samples, that is, to eliminate outliers contained in the data points. Abnormal data points may be caused by special reasons (such as wafer mishandling, wrong recipe, poor quality raw materials, wrong data input, sudden system error, etc.) in wafer production. If the data samples are directly analyzed without eliminating abnorm...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F19/00H01L21/00
Inventor 杨斯元
Owner SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products