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Method for encapsulating LED chip

A technology of LED chips and packaging methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve problems such as complex processes, many steps, and poor application

Inactive Publication Date: 2009-10-28
郑榕彬
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method of encapsulation using a mold has relatively many steps and a complicated process.
Moreover, the above-mentioned dispensing or coating methods cannot be well applied to situations such as when the chip is tilted

Method used

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  • Method for encapsulating LED chip
  • Method for encapsulating LED chip
  • Method for encapsulating LED chip

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Embodiment Construction

[0019] [0019] The present invention is characterized in that: utilizing the water-based properties of the packaging material, the packaging material is evenly sprayed onto the surface of the LED chip through a spraying process. In the spraying process, spraying devices such as conventional spray guns can be used to achieve uniform thickness control of the packaging material layer.

[0020] [0020] According to the present invention, a method for encapsulating a light-emitting diode (LED) chip is provided, comprising the steps of: placing the LED chip on a substrate; layer thickness. This spraying can be performed with a spraying device such as a spray gun. The encapsulation method may further include the step of curing the encapsulation layer. The curing step can be realized by heating, irradiating with UV light, or energizing the LED chip to generate heat. According to the present invention, there is also provided a packaged chip of a light-emitting diode LED, which include...

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Abstract

The invention provides a method for encapsulating a light-emitting diode (LED). The encapsulating method comprises the following steps: arranging an LED chip on a substrate; and ejecting an encapsulating material onto the surface of the LED chip to evenly control the thickness of an encapsulation layer. The ejection is realized through spray technology by a spray gun. The encapsulating method further comprises a step of curing the encapsulation layer. The curing step can be realized by any mode of heating, UV light radiation or electrifying and heating the LED chip. The encapsulating material comprises an ultraviolet (UV) photo-curing adhesive and can further comprise fluorescent powder and diluent.

Description

technical field [0001] [0001] The present invention generally relates to a packaging method for a light-emitting diode (LED) chip, in particular to a method for uniformly coating a packaging material onto an LED chip. Background technique [0002] [0002] At present, most of the packaging materials of traditional light-emitting diodes (LEDs) use epoxy resin. Due to the poor heat resistance of epoxy resin, the epoxy resin may change color before the life of the LED chip itself is reached. Epoxy materials can be affected not only by thermal phenomena, but also by the wavelength of light, since epoxy is relatively easily damaged by short-wavelength light in white LEDs. [0003] [0003] For this reason, silicone resin and ceramics have been used in the art as packaging materials to overcome the above-mentioned problems of epoxy resin. For example, Chinese Patent Application Publication No. CN1858920A discloses a packaging method for white light LED lamps, which includes sealing ...

Claims

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Application Information

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IPC IPC(8): H01L33/00
Inventor 郑榕彬
Owner 郑榕彬
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