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High-temperature resistant one-component isotropic conductive adhesive and preparation method thereof

An isotropic, conductive adhesive technology, used in conductive adhesives, adhesives, epoxy resins, etc., can solve problems such as poor high temperature resistance, and achieve high mechanical properties, good controllability, and easily available raw materials. Effect

Inactive Publication Date: 2009-10-14
JIANGSU POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a simple and low-cost single-component isotropic conductive adhesive method to overcome the shortcomings of traditional conductive adhesives with poor high temperature resistance

Method used

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  • High-temperature resistant one-component isotropic conductive adhesive and preparation method thereof
  • High-temperature resistant one-component isotropic conductive adhesive and preparation method thereof
  • High-temperature resistant one-component isotropic conductive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The composition and mass percentage of the conductive adhesive are as follows: epoxy resin EPON828 10.6%; silver nanowire 65%; AG-804.5%; MX1257%; TS-7200.6%; NC5130.7%; Methyltetrahydrophthalic anhydride 11%; 2-ethyl-4-methyl-imidazole 0.2%.

[0027] The preparation process and process are as follows:

[0028] First, mix epoxy resin EPON828, core-shell toughened epoxy resin MX125, phenyltrimethoxysilane, multifunctional epoxy resin AG-80, fumed silica TS-720, toughness diluent NC513, and then Process in a vacuumized high-speed mixer at a rate of 2000 rpm for 3 minutes, then add dried silver nanowires in proportion to it, and process it in a mixer at 2000 rpm for 3 minutes, take it out after mixing, and add assimilated silver nanowires to it. agent methyltetrahydrophthalic anhydride and curing accelerator 2-ethyl-4-methyl-imidazole. After mixing at 2000 rpm for 30s, take it out and package it in a special rubber tube. The curing condition is 170°C, 30min. The shear ...

Embodiment 2～10

[0033] A method for preparing a single-component high-temperature-resistant isotropic conductive adhesive, the preparation process and process are the same as in Example 1. The mass percentages of each component are as follows:

[0034]

[0035] Each embodiment can prepare a single-component high-temperature-resistant isotropic conductive adhesive product. The comprehensive performance has the characteristics and effects described in the content of the present invention, and can meet the bonding of structural parts of different substrates.

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Abstract

The invention provides a high-temperature resistant one-component isotropic conductive adhesive and a preparation method thereof. The one-component isotropic conductive adhesive capable of resisting the high temperature of 180 DEG C for a long time is prepared by adding silver nano-wire as the conductive filler to an epoxy resin matrix and adding core-shell structure toughening epoxy resin and poly-functional epoxy resin as modifiers. The conductive adhesive comprises the following components by the mass percentage: 10% to 15% of matrix epoxy resin, 62% to 65% of silver nano-wire, 3.5% to 5.5% of poly-functional epoxy resin, 6% to 10% of core-shell structure toughening epoxy resin, 0.4% to 0.6% of gas-phase silicon dioxide, 0.6% to 1.0% of toughening diluting agent, 0.3% to 0.4% of coupling agent, 9% to 15% of curing agent and 0.1% to 0.2% of curing accelerator. The invention has the advantages of simple preparation method, good controllability, high material availability and mild preparation condition.

Description

technical field [0001] The invention belongs to the technical field of preparation of microelectronic packaging materials, and in particular relates to a single-component high-temperature-resistant isotropic conductive adhesive and a preparation method thereof. Background technique [0002] Pb / Sn solder is the basic connection material on printed circuit boards, and it is also commonly used in SMT (Surface Mount Technology). With the development of miniaturization and portability of electronic products and the continuous improvement of device integration, it is urgent to develop new connection materials and methods. From the early 1990s to the present, the number of I / Os on ICs has grown from 500 to 1,500, and is expected to reach 3,800 in 2005, 4,600 in 2008, and 8,000 in 2010. High I / O densities require connection materials with high line resolution. Pb / Sn solder can only be used for connections with a pitch below 0.65mm, which cannot meet the needs of the process. The ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/00C09J11/04
Inventor 陶宇刘澄吴海平陶国良
Owner JIANGSU POLYTECHNIC UNIVERSITY
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