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Method for preparing tungsten-copper alloy wires by utilizing hot-swage technology

A technology of tungsten-copper alloy and hot swaging, which is applied in the direction of metal/alloy conductors, manufacturing tools, metal processing equipment, etc., can solve the problems of high production cost and complicated process, and achieve low production cost, simple preparation process and low operating cost low effect

Inactive Publication Date: 2009-09-23
BEIJING SHANGHUAYANG ELECTRONICS TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for preparing tungsten-copper alloy wire by hot swaging technology, which solves the problems of complex process and high production cost in the prior art for preparing slender tungsten-copper materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Wires of tungsten-copper alloy W70Cu30 with a diameter of 3 mm, a length of 300 mm, and a weight percentage of 70 and 30 were prepared.

[0017] Step 1, prepare copper, tungsten and nickel powders with a particle size of 200 mesh copper powder, tungsten powder and nickel powder with a particle size of 6 μm and added ethanol in the following weight ratio, and mechanically mix the four ingredients together for 6 hours,

[0018] Copper powder 20 grams Tungsten powder 35 grams

[0019] 0.05 grams of nickel powder 0.5 milliliters of ethanol is 1wt%;

[0020] Step 2, adding 5 milliliters of Buna-solvent gasoline solution with a concentration of 55 wt% to the mixture obtained in step 1, drying in the shade, mixing evenly and passing through a sieve of 80 mesh to obtain powder;

[0021] Step 3, put the tungsten-copper mixed powder in step 2 into the "three-high" graphite mold with a cavity diameter of 10mm and a length of 200mm by high-speed fluid, and give 10kg impact pressin...

Embodiment 2

[0026] Wires of tungsten-copper alloy W85Cu15 with a diameter of 2 mm and a length of 400 mm and a weight percent of 85 and 15 were prepared.

[0027] Step 1: Prepare copper powder with a particle size of 200 mesh, tungsten powder and nickel powder with a particle size of 8 μm, and added ethanol in the following weight ratio, and mechanically mix the four ingredients together for 6 hours.

[0028] 11.25 grams of copper powder, 29.75 grams of tungsten powder, 0.045 grams of nickel powder, 0.45 milliliters of ethanol or 1 wt%;

[0029] Step 2, add 4.5 milliliters of 55wt% Buna rubber-solvent gasoline solution to the mixed material obtained in step 1, half-dry in the shade, mix evenly and pass through an 80-mesh sieve to obtain powder;

[0030] Step 3, put the tungsten-copper mixed powder in step 2 into the "three-high" graphite mold with a cavity diameter of 10mm and a length of 200mm by high-speed fluid, and give 10kg impact pressing pressure at the same time;

[0031] Step 4:...

Embodiment 3

[0035] A wire of tungsten-copper alloy W80Cu20 with a diameter of 3 mm and a length of 500 mm is prepared.

[0036] Step 1: Prepare copper powder with a particle size of 200 mesh, tungsten powder and nickel powder with a particle size of 7 μm, and added ethanol in the following weight ratio, and mechanically mix the four ingredients together for 6 hours.

[0037] 15 grams of copper powder, 40 grams of tungsten powder, 0.05 grams of nickel powder, 0.5 milliliters of ethanol is 1wt%;

[0038] Step 2, add 5 milliliters of 55wt% Buna rubber-solvent gasoline solution to the mixed material obtained in step 1, half-dry in the shade, mix evenly and pass through an 80-mesh sieve to obtain powder;

[0039]Step 3, put the tungsten-copper mixed powder in step 2 into the "three-high" graphite mold with a cavity diameter of 10mm and a length of 200mm by high-speed fluid, and give 10kg impact pressing pressure at the same time;

[0040] Step 4: Put the above-pressed compact together with th...

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Abstract

The invention discloses a method for preparing tungsten-copper alloy wires by utilizing hot-swage technology, belonging to the technical field of new material manufacture. The method comprises the following steps of: weighing copper powder, tungsten powder and nickel powder according to weight percentage, then weighing alcohol additionally, and mechanically mixing the four batching materials together; additionally weighing sodium butadiene rubber-solvent gasoline solution, adding the sodium butadiene rubber-solvent gasoline solution into the mixture obtained by the former step, mixing evenly and then sieving; making graphite die-pressing and forming blank; carrying out sintering and hot-swage to obtain the wires with certain diameters and any length. The invention has the beneficial effects of simple technique, convenient operation and low manufacturing cost, also has the advantages of stable performance, high quality and high yield, solves the problems that the preparation of thin and long tungsten-copper material has complex technique and high manufacturing cost in the prior art and is widely used for processing materials such as electrodes, LED lamps and plasmas.

Description

technical field [0001] The invention belongs to the technical field of new material manufacture, and in particular relates to a method for preparing tungsten-copper alloy wires by hot swaging technology for electrodes, LED lamps and plasmas. Background technique [0002] Tungsten copper alloy is widely used as electrode material, electronic packaging and electrical contact material because of its good electrical conductivity, thermal conductivity and arc corrosion resistance. When used as an electrode, it is often required to have a diameter of about 3mm, and the longer the length, the better. Now In the prior art, the preparation of tungsten-copper alloy wire is generally molded and pressed by cold isostatic pressing equipment to form a rod several times larger than required, and then sintered and then machined to obtain the required alloy wire. At present, because tungsten-copper alloy is a pseudo-alloy, coupled with the high hardness and high melting point of tungsten, it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21C37/04B22F1/00B22F3/16B21J7/16H01B13/00H01B1/02H01B5/02
Inventor 陈文革段沛林叶恒
Owner BEIJING SHANGHUAYANG ELECTRONICS TECH DEV
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