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Cleaning equipment of semiconductor silicon chip and cleaning method thereof

A technology for cleaning equipment and semiconductors, which is applied in the directions of cleaning methods using liquids, cleaning methods using gas flow, cleaning methods and utensils, etc., which can solve the problem of high cost of cleaning equipment, reduce equipment costs, ensure production capacity, and improve production efficiency. Effect

Inactive Publication Date: 2009-09-16
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a cleaning equipment and cleaning method for semiconductor silicon wafers, to solve the problem of high cost of existing semiconductor silicon wafer cleaning equipment

Method used

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  • Cleaning equipment of semiconductor silicon chip and cleaning method thereof
  • Cleaning equipment of semiconductor silicon chip and cleaning method thereof

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Embodiment Construction

[0026] The semiconductor silicon wafer cleaning equipment and cleaning method proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that the drawings are all in a very simplified form and use imprecise ratios, which are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0027] Please refer to Figure 1A to Figure 1B , which is a schematic diagram of semiconductor silicon wafer cleaning equipment provided by an embodiment of the present invention, wherein Figure 1A For a top view diagram, Figure 1B It is a schematic side view, the semiconductor silicon wafer cleaning equipment 100 includes a plurality of process chambers connected in series to perform a cleaning process, and the cleaning proces...

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Abstract

The invention discloses cleaning equipment of a semiconductor silicon chip and a cleaning method thereof. The cleaning equipment comprises a plurality of process cavities which are connected in series, lift separators, rotatable platforms, mechanical arms and cleaning cantilevers, wherein the lift separators are arranged among a plurality of process cavities; the rotatable platforms are arranged in the plurality process cavities for supporting the silicon chip; the mechanical arms are arranged in the plurality of process cavities for conveying the silicon chip among the plurality of process cavities; the cleaning cantilevers are arranged in the plurality of process cavities, and are provided with nozzles which are connected with cleaning agent feed pipelines and inert gas feed pipelines; each process cavity is subjected to different cleaning steps, and is provided with the cleaning agent feed pipeline and the inert gas feed pipeline required by different cleaning steps, thereby greatly simplifying the equipment structure, reducing equipment cost, and improving production efficiency.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a semiconductor silicon wafer cleaning device and cleaning method. Background technique [0002] With the continuous improvement of integrated circuit manufacturing technology, the volume of semiconductor devices is becoming smaller and smaller, which also leads to the fact that if very small particles on silicon wafers are not cleaned, they will also affect the manufacture and performance of semiconductor devices. Therefore, Wafer cleaning processes are also becoming more and more important. Compared with the traditional immersion cleaning method, which uses immersion technology to process multiple silicon wafers at the same time, the single-wafer cleaning method can better control the distribution of the cleaning agent on the surface of the silicon wafer, and the high-speed rotation of the silicon wafer itself also makes the silicon The cleaning agent on the sur...

Claims

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Application Information

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IPC IPC(8): H01L21/00B08B3/02B08B3/12B08B5/02
Inventor 张晨骋
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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