Metal faced integral-linking chip substrate insulated and decorated board and manufacturing method thereof

Abstract

The invention relates to a metal faced integral-linking chip substrate insulated and decorated board and a manufacturing method thereof. The uppermost layer of the cast-in-situ molding integral-linking chip substrate board is a decorated surface of metal plate, a button stem is installed between the upper and the lower layers of the integral-linking chip substrate board, foaming insulation boards with holes are between the button stem and the upper and lower layers of the cast-in-situ molding integral-linking chip substrate board, and the holes are used for forming the button stem. The preparation method is as follows: a steel bracket, a template and a mould are displaced on a vibration workbench, sizing agent is applied for the first time and the steel bracket, the template and the mould are put into the foaming insulation boards, the holes for forming the button stem are between the foaming insulation boards, sizing agent is applied for the second time, a cast-in-situ molding internal-linking substrate board is formed, the upper-layer fiber mesh and non-woven fabrics are paved smoothly, static maintenance and white-hard drying are carried out, the metal decorated board is pressed, bonded, and is edge-molded. The insulated decorated board has quick site operation, easy processing and mounting in site, light weight, high integrated intensity, good insulation performance, good weather resistance, good surface decorative performance, and difficult ablation among layers.

Description

technical field [0001] The invention relates to a heat-preservation decorative board with a metal surface layer integrated core-base base and a manufacturing method thereof. Background technique [0002] The building exterior wall insulation system currently in use (EPS board, XPS board external plastering technology and thermal insulation coating technology) has complex construction technology, wet work on site, long construction period, heavy insulation layer weight, increased building load, and surface decoration. Not good, there are disadvantages such as easy foaming, cracking, water seepage, and short service life. There is also a composite exterior wall insulation material with aluminum alloy as the panel and polystyrene extruded board as the bottom plate. Although it solves the problem of wet construction on site, the construction speed is high and the surface decoration is good, but due to this The extruded polystyrene board (XPS) base plate of the material is expos...

AI Technical Summary

Problems solved by technology

[0002] The building exterior wall insulation system currently in use (EPS board, XPS board external plastering technology and thermal insulation coating technology) has complex construction technology, wet work on site, long construction period, heavy insulation layer weight, increased building load, and surface decoration. Not good, there are disadvantages such as easy foaming, cracking, water seepage, and short service life

There is also a composite exterior wall insulation material with aluminum alloy as the panel and polystyrene extruded board as the bottom plate. Although it solves the problem of wet construction on site, the construction speed is high and the surface decoration is good, but due to this The extruded polystyrene board (XPS) base plate of the material is exposed and the fire performance is extremely poor. Another disadvantage of the material is that the aluminum alloy panel is directly bonded to the polystyrene board, so the bonding strength is not high

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