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Varnish for partial discharge resistant enameled wire and partial discharge resistant enameled wire

A partial discharge, enameled wire technology, applied in coatings, circuits, electrical components, etc., can solve problems such as insulation damage, and achieve the effects of excellent tensile resistance, improved partial discharge resistance, excellent uniform dispersion and transparency

Active Publication Date: 2009-09-09
HITACHI MAGNET WIRE CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In addition, in recent years, inverter surges (sudden overvoltage) have occurred in systems such as motors that drive inverters used for energy saving and variable speeds, and insulation breakdown has increased.

Method used

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  • Varnish for partial discharge resistant enameled wire and partial discharge resistant enameled wire
  • Varnish for partial discharge resistant enameled wire and partial discharge resistant enameled wire
  • Varnish for partial discharge resistant enameled wire and partial discharge resistant enameled wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] To trans-2 (hydroxyethyl isocyanurate) modified polyester-imide enameled wire coatings, disperse hollow organosilica sol (benzyl alcohol / naphtha mixed dispersion medium, average silica The particle size is 23nm and the hollow volume ratio is 30%), so that the silica component is 20 parts by weight (parts by mass) relative to 100 parts by weight (parts by mass) of the resin component, thereby obtaining a partial discharge-resistant polyester-imide enameled wire Use paint.

Embodiment 2

[0057] To trans-2 (hydroxyethyl isocyanurate) modified polyester-imide enameled wire coatings, disperse hollow organosilica sol (benzyl alcohol / naphtha mixed dispersion medium, average silica The particle size is 45 nm and the hollow volume ratio is 35%), so that the silica component is 50 parts by weight relative to 100 parts by weight of the resin component, thereby obtaining a partial discharge resistant polyester-imide enameled wire coating.

Embodiment 3

[0059] In the coating for polyamide-imide enameled wire, the hollow organosilica sol (γ-butyrolactone dispersion medium, the average particle size of silica is 23nm, the hollow volume ratio is 30%) is dispersed so that the silica component is relatively 100 parts by weight of the resin component is 20 parts by weight to obtain a polyamide-imide enamelled wire coating that is resistant to partial discharge.

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PUM

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Abstract

The invention provides a and the partial discharge resistant enameled wire, and the varnish for a partial discharge resistant enameled wire simultaneously realizes the increase of the partial discharge initial voltage resulting from a low dielectric rate and corrosion inhibiting effect of partial discharge caused by inorganic materials from the fill; the varnish has superior live life features. The varnish for a partial discharge resistant enameled wire is obtained by selecting an organosol including an inorganic fine particle comprising a metal oxide fine particle or a silicon oxide fine particle. The organosol is dispersed in the insulating varnish. The inorganic fine particle includes a hollow portion therein.

Description

Technical field [0001] The invention relates to a paint for an enameled wire resistant to partial discharge and an enameled wire resistant to partial discharge. Background technique [0002] Partial discharge is when there are small gaps in or between the insulators of wires, cables, etc., the electric field is concentrated in this part, and a weak discharge is generated. When a partial discharge occurs, the insulator deteriorates until the insulation is broken. [0003] Mainly, in coils used in coils of motors, transformers, etc., especially enameled wires in which a sintered resin paint is applied to a conductor to form an insulating film, the partial discharge is mainly between the lines (between the film and the film) or against Ground (between the film and the core) occurs between the molecular chains of the resin film or between the ground (between the film and the core) due to the impact of charged particles, and the resin film is caused by the impact of the charged partic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D179/08C09D7/12C09D5/25H01B3/30C09D7/61
CPCC08K3/36H01B3/308C08K7/24H01B3/306C09D7/1291C09D7/1216C09D7/1266H01B3/006C09D7/61C09D7/67C09D7/70Y10T428/2927
Inventor 菊池英行高野雄二本田佑树
Owner HITACHI MAGNET WIRE CORP
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