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Cleaning-free water-soluble welding flux for lead-free welding and preparation method thereof

A water-soluble, no-clean technology, used in welding equipment, welding media, manufacturing tools, etc., can solve problems such as increased production cost, high welding temperature, poor wetting ability, etc., to achieve cost savings, good welding performance, and wettability. strong effect

Inactive Publication Date: 2009-09-09
TAIZHOU ZHONGYI COMM DEVICE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Soldering flux is widely used in the soldering technology of electronic information products. Due to the requirements of global environmental protection and the development of the electronic information industry, it is an inevitable trend to realize lead-free electronic information products. Due to the current lubricity of lead-free solder Poor wettability and high soldering temperature, therefore, the flux corresponding to lead-free solder needs to have a strong activity, and has strong activity for conventional water-soluble fluxes, and is highly corrosive. In order to ensure the electrical insulation of electronic products Therefore, it is necessary to use chlorofluorocarbons or organic solvents as cleaning agents. These chemicals are depleting substances that destroy the atmospheric ozone layer or promote Climate-changing substances are also substances that do not meet environmental protection requirements and are gradually banned. At the same time, the use of organic solvents not only increases production costs, causes waste of resources, but also poses safety hazards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example example 1

[0012] First add 10% isopropanol, 2% terpineol and 75.9% deionized water by weight in a reactor with a stirrer to stir, add 10% water-soluble modified After the water-soluble modified rosin is dissolved, add 0.3% of OP-10 polyglycol ethyl octyl phenyl ether, 1.5% of sulfamic acid, 0.15% of diethylamine Hcl and 0.15% of diphenyl Guanidine HBr continued to stir, and after stirring for 120 minutes, a uniformly stirred solution was obtained, that is, no-cleaning water-soluble flux for lead-free soldering.

[0013] After testing, the surface resistance of the no-clean water-soluble flux for lead-free soldering prepared in this example after electromigration is >1×10 12 Ohm, expansion rate > 80%, ion pollution 2 , There is no penetration in the copper mirror corrosion test, and there is no pungent odor during welding, which meets the requirements of the SJ / T11168 solder wire standard for no-clean welding.

Embodiment 2

[0015] First, add 15% isopropanol, 5% benzyl alcohol and 63.3% deionized water by weight in a reaction kettle with a stirrer to stir, and add 15% water-soluble modified After the water-soluble modified rosin is dissolved, add 0.4% of OP-10 polyglycol ethyl octyl phenyl ether, 1% of malic acid, 0.15% of dimethylamine HBr and 0.15% of cyclohexylamine The HBr continued to stir, and after stirring for 120 minutes, a uniformly stirred solution was obtained, that is, no-cleaning water-soluble flux for lead-free soldering.

[0016] After testing, the surface resistance of the no-clean water-soluble flux for lead-free soldering prepared in this example after electromigration is >1×10 12 Ohm, expansion rate > 80%, ion pollution 2 , There is no penetration in the copper mirror corrosion test, and there is no pungent smell during welding, which meets the requirements of the SJ / T11168 solder wire standard for no-clean welding.

Embodiment 3

[0018] First add 18% isopropanol, 3% terpineol and 56.1% deionized water by weight in a reactor with a stirrer to stir, add 20% water-soluble modified After the water-soluble modified rosin is dissolved, add 0.5% of OP-10 polyglycol ethyl octyl phenyl ether, 2% of tartaric acid, 0.2% of cyclohexylamine HCl and 0.2% of diphenylguanidine HBr Continue to stir, and stir for 120 minutes to obtain a uniformly stirred solution, that is, no-cleaning water-soluble flux for lead-free soldering.

[0019] After testing, the surface resistance of the no-clean water-soluble flux for lead-free soldering prepared in this example after electromigration is >1×10 12 Ohm, expansion rate > 80%, ion pollution 2 , There is no penetration in the copper mirror corrosion test, and there is no pungent smell during welding, which meets the requirements of the SJ / T11168 solder wire standard for no-clean welding.

[0020] The lead-free solder used in the present invention is Sn-0.7Cu-0.04Ni lead-free sold...

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PUM

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Abstract

The invention discloses a cleaning-free water-soluble welding flux for lead-free welding, which comprises the following components of water-soluble modified rosin, organic acid active agent, halide active agent, nonionic surface active agent, flux and solvent deionized water. The invention also discloses a preparation method of the cleaning-free water-soluble welding flux for lead-free welding, which comprises the following steps: firstly, adding the flux and the deionized water in a reaction vessel with a stirrer according to a certain weight percentage for stirring; adding the water-soluble modified rosin according to the weight percentage in the stirring process; and secondly, adding the nonionic surface active agent, the organic acid active agent and the halide active agent for stirring continuously after dissolving the water-soluble modified rosin, and obtaining the cleaning-free water-soluble welding flux for lead-free welding after uniform stirring. The invention ensures high reliability of electronic information products, causes lead-free welding operating environment to be safe and reliable, conforms to the environmental protection requirements and saves energy resources simultaneously.

Description

technical field [0001] The invention relates to a no-cleaning water-soluble flux for lead-free soldering and a preparation method thereof. Background technique [0002] Soldering flux is widely used in the soldering technology of electronic information products. Due to the requirements of global environmental protection and the development of the electronic information industry, it is an inevitable trend to realize lead-free electronic information products. Due to the current lubricity of lead-free solder Poor wettability and high soldering temperature, therefore, the flux corresponding to lead-free solder needs to have a strong activity, and has strong activity for conventional water-soluble fluxes, and is highly corrosive. In order to ensure the electrical insulation of electronic products Therefore, it is necessary to use chlorofluorocarbons or organic solvents as cleaning agents. These chemicals are depleting substances that destroy the atmospheric ozone layer or promote...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/40
Inventor 施义明
Owner TAIZHOU ZHONGYI COMM DEVICE
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