Resin film formation method and resin film formation device

Abstract

To form a resin film having a uniform thickness and excellent smoothness, to provide a substrate which does not warp and has excellent planarity, and to clarify whether the resin film at the boundary between light irradiation region and light non-irradiation region is hardened or not. At the time of or after flatting a liquid substance applied on a substrate by rotation, light irradiation is shifted from the center of the substrate toward the outer circumference and the liquid substance is hardened to form a resin film. The light is annularly applied, and the inner diameter and the outer diameter of the annular light concentrically increase with the rotation center axis line with the lapse of the irradiation time, and the annular light shifts from the inner circumference toward the outer circumference on the substrate.

Description

technical field [0001] The present invention relates to a resin film forming method and a resin film forming apparatus suitable for forming an adhesive layer with a uniform film thickness between a substrate such as an optical disk and a substrate, or forming a resin film with a uniform film thickness on the substrate. Background technique [0002] In general, optical discs (second-generation optical discs) basically have the following structure: For example, a structure in which one or two recording layers are formed on a transparent resin substrate with a thickness of about 1.1 mm and protected with a transparent resin film ; Or use a transparent adhesive resin film to bond two transparent resin substrates with a thickness of about 0.6mm. In this case, the signal recording layer may be formed on only one of the above-mentioned transparent resin substrates, or the signal recording layer may be formed on two substrates, and the thickness of the two substrates may be equal, o...

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Problems solved by technology

However, if this method is used, when the radiation curable resin is irradiated with radiation while the radiation curable resin is spread by the spin coating method, the radiation curable resin that is thrown off will adhere to the mask member and be cured. , therefore, it is difficult to irradiate the radiation during the extension process

Furthermore, in the radiation irradiation methods disclosed in Patent Documents 4 and 5, when the radiation is irradiated with a rotating device, the radiation-curable resin that is thrown off will adhere to the inner wall of the rotating device and be cured. Therefore, there is a problem that the radiation irradiation process must be performed at a position different from that of the rotating device.

In addition, since the method of shielding the mask member from light cannot make the mask member come into contact with the radiation curable resin, the leaked radiation will irradiate the resin film, so that the softened and cured boundary region of the resin film is halfway. Therefore, even if the high-speed rotation process is performed thereafter, it is difficult to make the thickness of the resin film uniform

In addition, since the mask mechanism is provided, there is a problem of not only increasing the size and complexity of the device, but also increasing the cost.

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