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Polishing apparatus and polishing method

A grinding device and grinding method technology, which is applied in the direction of grinding devices, grinding machine tools, electrical components, etc., can solve the problems of sensors changing, different, sensors not being able to correctly evaluate the film thickness, etc.

Active Publication Date: 2009-08-19
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the conventional polishing equipment, there is a problem that the sensor signal value obtained in a certain area of ​​the substrate is significantly different from that in other areas, and the sensor cannot accurately evaluate the film thickness.
That is, if a conductive metal member such as SUS or a magnetic material is used for the top ring, the value of the signal of the sensor will change locally due to its influence

Method used

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  • Polishing apparatus and polishing method
  • Polishing apparatus and polishing method

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Embodiment Construction

[0043] Below, refer to Figure 1 to Figure 24 Embodiments of the present invention will be described in detail.

[0044] figure 1 It is a schematic diagram which shows the whole structure of the polishing apparatus concerning embodiment of this invention. like figure 1 As shown, the polishing apparatus includes: a polishing table 12 on which a polishing pad 10 is pasted; The upper surface of the polishing pad 10 constitutes a polishing surface that is in sliding contact with a wafer as an object to be polished.

[0045]The grinding table 12 is connected to a motor (not shown) disposed below it, and can rotate around its axis as indicated by an arrow. In addition, a polishing liquid supply nozzle (not shown) is provided above the polishing table 12 , and the polishing liquid is supplied onto the polishing pad 10 from the polishing liquid supply nozzle.

[0046] The top ring 14 is connected to a top ring shaft 18 via which it is connected to an electric motor and a lifting ...

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Abstract

The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a semiconductor wafer, to planarize the substrate. The polishing apparatus according to the present invention includes a polishing table (10) having a polishing surface, a top ring (14) configured to press the substrate against the polishing table by applying pressing forces independently to first plural zones on the substrate, a sensor (50) configured to detect a state of the film at plural measuring points, a monitoring device (53) configured to produce monitoring signals with respect to second plural zones on the substrate, respectively, a storage device configured to store plural reference signals each indicating a relationship between reference values of each monitoring signal and polishing times, and a controller configured to operate the pressing forces against the first plural zones such that the monitoring signals, corresponding respectively to the second plural zones, converge on one of the plural reference signals.

Description

technical field [0001] The present invention relates to a polishing device and a polishing method, and more particularly, to a polishing device and a polishing method for polishing and planarizing a substrate such as a semiconductor wafer. Background technique [0002] As a polishing apparatus for polishing and planarizing a substrate such as a semiconductor wafer, there is known a polishing apparatus capable of independently adjusting the pressure of a plurality of chambers in a top ring (top ring). In this polishing apparatus, for example, a sensor measures a physical quantity related to a film thickness on a substrate, and a monitor signal is generated based on the physical quantity. Before the substrate is polished, a reference signal representing the relationship between the monitor signal and time is prepared in advance, and during grinding, the pressing force of the top ring is adjusted so that the monitor signal at each measurement point on the substrate converges to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04B24B37/00H01L21/304
CPCB24B37/013B24B37/04H01L21/304
Inventor 小林洋一广尾康正大桥刚
Owner EBARA CORP
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