Planet grinding device

Abstract

The planet grinding machine, which comprises a grinding disc, wherein the grinding disc consists of a tool player provided with a plurality of tool counter bores and a plurality of liquid holes and a grinding layer provided with radially and uniformly distributed grinding fluid embedded grooves with axial depth. The tool layer and the grinding layer are split and connected into a whole through a fastening piece, the grinding layer consists of a grinding liquid embedded groove layer, a solid layer and a convex rib grid layer, the solid layer is provided with through holes corresponding to the liquid holes, the liquid holes are communicated with the grinding fluid embedded grooves through the through holes, and convex ribs on the convex rib grid layer are provided with a plurality of connecting counter bores which are uniformly distributed. In the planet grinding machine, an integral grinding disc made of cast iron or carbon steel is horizontally divided into two independent parts connected by a fastening piece without changing the overall shape and size of the prior grinding disc, the grinding layer can be changed independently after being worn, and the material is saved; and the grinding layer is insusceptible to thermal deformation, the factors influencing the internal stress are reduced, and the flatness, parallelism and service life of the grinding layer are ensured.

Description

【Technical field】 [0001] The invention belongs to a planetary grinder, in particular to a planetary grinder suitable for high-precision grinding or polishing of all semiconductor wafers and various crystal, optical and other sheet materials. 【Background technique】 [0002] Semiconductor wafers used in integrated circuits are made by cutting semiconductor crystal ingots. When cutting, due to changes in cutting conditions, internal circle cutting machines or wire cutting machines often have deviations in thickness and flatness of the slices, and even cause deep damage layers, which need to be eliminated by grinding. The deviation of flatness and the thickness of the damaged layer are eliminated. With the development of science and technology, the requirement of precision advances to micron and nanometer, which has higher requirements for grinding and polishing. [0003] Before the present invention is made, grinder kind mainly contains disc grinder, rotating shaft grinder an...

AI Technical Summary

Problems solved by technology

[0005] The existing planetary grinding machine has the following problems: the grinding disc is easily deformed by the influence of internal stress, and in the state of high-speed grinding or polishing, the grinding disc is easily deformed by heating, thereby affecting the flatness and parallelism (TTV) of the workpiece during the working process, The accuracy and quality of the workpiece will be reduced; the grinding surface, that is, the grinding layer, needs to be replaced as a whole after being worn out, and the grinding cost is high

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