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UV curing photosensitive resin for rapid moulding injection mold

A photosensitive resin and injection mold technology, which is applied in the field of UV-cured photosensitive resin for rapid prototyping injection molds, can solve problems such as resin research reports that have not yet been seen, and achieve the effects of reducing material costs, wide range of material selection, and low cost

Inactive Publication Date: 2009-07-15
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although there are many domestic units engaged in the research of rapid prototyping technology (such as Xi'an Jiaotong University, Tsinghua University, Huazhong University of Science and Technology, etc.), there are no research reports on resins used in rapid mold manufacturing in China.

Method used

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  • UV curing photosensitive resin for rapid moulding injection mold

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] The preparation method of E-44 epoxy acrylate monoester is as follows: the tetrabutyl ammonium bromide of the E-44 epoxy resin (Shanghai Tianyuan Resin Factory), 0.5g of 114g, 0.5g is put into In the four-necked flask with a thermometer, after heating to 90°C, 11.1 g of acrylic acid was added dropwise, then the temperature was raised to 110°C, and the reaction ended when the acid value was <3.

[0047] Photosensitive resin raw material quality composition: self-made synthetic E-44 epoxy acrylate monoester: E-44 epoxy resin (Shanghai Tianyuan Resin Factory): epoxy acrylate diester (Changxing Chemical Industry Co., Ltd.) = 1:1:1 (Total 7kg); Reactive diluent SR-379 (ie glycidyl methacrylate) (Sartomer, USA): 3kg; Adhesion promoter HMX-23 (Zhejiang Huangma Chemical Group): 0.2kg; Photoinitiator Irgacure184 (Vaporization): 0.25kg; Photoinitiator 250 (Jiangsu Huati): 0.25kg; Leveling agent BYK361 (Germany BYK): 0.01kg; Defoamer BYK066N (Germany BYK): 0.01kg .

[0048] Mix ...

Embodiment 2

[0052] Quality composition of photosensitive resin raw materials: self-made synthetic E-44 epoxy acrylate monoester: E-44 epoxy resin: epoxy acrylate diester = 1:1:1 (total 7kg); reactive diluent SR-379: 3kg; attached Focus accelerator HMX-23: 0.2kg; photoinitiator Irgacure 184: 0.25kg; photoinitiator 201 (Jiangsu Huati): 0.25kg; leveling agent BYK361: 0.01kg; defoamer BYK066N: 0.01kg;

[0053] Mix the resin raw materials, then put the resin into the liquid storage tank under the high-pressure mercury lamp of 1000W, and solidify layer by layer under the action of the mask until it is formed. 2.4KW) post-curing for 2 hours is the required mold.

[0054] ABS (HI-121H Ningbo Lejin Yongxing Chemical Co., Ltd.) was injected using the obtained mold. The processing temperatures were as follows: machine head temperature: 135°C, first zone: 190°C; second zone: 190°C; third zone: 180°C. Holding time: 10s, injection pressure 15Mpa. The mold can be re-injected more than 200 times withou...

Embodiment 3

[0056] Quality composition of photosensitive resin raw materials: self-made synthetic E-44 epoxy acrylate monoester: E-44 epoxy resin: epoxy acrylate diester = 1:1:1 (total 8kg); reactive diluent SR-379: 2kg; attached Focus accelerator HMX-23: 0.2kg; photoinitiator Irgacure 184: 0.25kg; photoinitiator 202 (Jiangsu Huati): 0.5kg; leveling agent BYK361: 0.01kg; defoamer BYK066N: 0.01kg;

[0057] Mix the resin raw materials, then put the resin into the liquid storage tank under the high-pressure mercury lamp of 1000W, and solidify layer by layer under the action of the mask until it is formed. 2.4KW) post-curing for 2 hours is the required mold.

[0058] Nylon-6 (101-3B) was injection-molded using the obtained mold, and the processing temperatures were as follows: machine head temperature: 135°C, first zone: 220°C; second zone: 200°C; third zone: 190°C. The holding time is 50s, and the injection pressure is 45Mpa. The mold can be re-injected more than 200 times without breaking...

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Abstract

The invention provides an ultraviolet-cured photosensitive resin for rapidly-forming injection mold, which is prepared by the raw materials having the following mass proportions: the active ingredients contain: a mixture of an oligomer A, an oligomer B and an epoxy resin with a ratio of 1:1:1, 70-80% (based on the total mass percent of the active ingredients, similarly hereinafter); an active diluting agent, 20-30%; auxiliary agents contain: an antifoaming agent, 0.1-1.0%; a flatting agent, 0.1-1.0%; an adhesive force accelerating agent, 0.01-5%; a radical initiator, 1-10% and a cation initiator, 1-10%; the inventive beneficial effects lie in: simple preparation method, wide material selection range, low costs and the like; as the material for manufacturing direct injection molds has higher requirements in mechanical properties, size, precision and the like than the material manufactured by rapid prototypes, the research result can be spread to the field of general prototypes extremely easily, which can promisingly lower the cost of the material manufactured by SLA prototypes to a great extent; the research achievement can also be spread to the development fields of general ultraviolet-cured coatings and bonding agents to improve the quality of related products.

Description

(1) Technical field [0001] The invention relates to an ultraviolet light curing photosensitive resin for rapid prototyping injection molds. (2) Background technology [0002] UV curing material is an important variety of polymer materials. It uses the active fragments produced by the photosensitive substance in the liquid resin under the action of ultraviolet light to initiate polymerization and crosslinking reactions, and realizes curing in an instant. [0003] Laser rapid prototyping technology (RP) is a new manufacturing method based on the principle of discrete and accumulation molding. It integrates laser technology, CAD / CAM technology and material technology, and uses materials to accurately accumulate prototypes or parts. The traditional mechanical cutting, chipping, planing, grinding and other material decreasing processing methods are eliminated. Its basic principle is: [0004] The light-curing resin is contained in the resin tank, and there is a computer-contro...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/10B29C45/26
Inventor 王德海马国杰孙兴平贺锡挺龚春林徐超
Owner ZHEJIANG UNIV OF TECH
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