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Liquid Immersion Cooling System

A technology of cooling liquid and cooling liquid, which is applied in the direction of cooling/ventilation/heating transformation, electric solid-state devices, semiconductor devices, etc., and can solve problems such as errors and power fluctuations

Active Publication Date: 2016-02-17
LIQUIDCOOL SOLUTIONS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Running at high temperatures can cause power fluctuations, which can lead to errors where data is processed on the central processing unit (CPU) or on the motherboard.

Method used

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Examples

Experimental program
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Embodiment Construction

[0043] A liquid immersion cooling system suitable for cooling a variety of electronic devices, including cooling heat-generating components in computer systems and cooling other systems that use electronic heat-generating components. If it is a computer system, the liquid immersion cooling system can be used for a scalable desktop computer, in which there may be 32 to 64 or more chip processing systems (8 sockets x 8 cores = 64 processors). The processing power of these desktop computer systems matches or exceeds that of supercomputing systems, which until now had a large footprint.

[0044]Electronic devices as used herein include, but are not limited to, desktop computers and other personal computers, including portable computers, floor-standing game consoles, and hand-held devices such as tablet computers, wearable computers, and personal digital assistants; servers, including blade servers; Disk arrays / storage systems; storage area networks; storage communication systems; ...

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Abstract

A self-contained portable liquid immersion cooling system suitable for cooling a variety of electronic devices, including cooling heat-generating components in computer systems and cooling other systems that use electronic heat-generating components. The electronic device includes a housing with an internal space, an electrically insulating cooling liquid in the internal space, an electronic heating component disposed in the internal space and immersed in the electrically insulating cooling liquid, and a pump, the pump is used for cooling Liquid is fed into or out of this interior space, and cooling liquid is fed into or out of a heat exchanger fixed outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow channel for the cooling liquid to flow from the cooling liquid inlet therethrough to the cooling liquid outlet. Air supply devices such as fans can be used to flow air through the heat exchanger to improve heat transfer.

Description

[0001] This application is filed in the name of Solid Core Computer Corporation and claims U.S. Provisional Application No. 60 / 800,715, filed May 16, 2006, and U.S. Provisional Application No. 11, filed April 18, 2007 / 736,947, which are incorporated by reference in their entirety into this application. technical field [0002] The present invention relates to a liquid immersion cooling system, and more particularly to a liquid immersion cooling system suitable for cooling electronic devices including computer systems. Background technique [0003] Heat generation is a major problem facing the computer industry. Because the hotter a component runs, the more likely it is to fail. High temperatures, while not causing catastrophic failure, can cause errors in data processing. Running hot can cause power fluctuations, which can lead to errors wherever data is being processed on the central processing unit (CPU) or on the motherboard. Despite great efforts to reduce waste heat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201H05K7/20236H05K7/20772Y10S165/908H01L2924/0002H05K7/20263H05K7/20345H01L2924/00G06F1/16H05K5/0204H05K7/20
Inventor 查德·丹尼尔·阿特里斯R·达仁·克鲁姆艾伦·詹姆士·伯宁
Owner LIQUIDCOOL SOLUTIONS
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