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Epoxy resin encapsulating material and preparation thereof

A technology of epoxy resin and packaging material, applied in chemical instruments and methods, other chemical processes, etc., can solve problems such as large dielectric loss and low electrical breakdown strength

Inactive Publication Date: 2009-05-27
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the disadvantages of large dielectric loss and low electrical breakdown strength of epoxy resin packaging materials in the prior art, the present invention provides an epoxy resin packaging material using α-phase sheet Al 2 o 3 Ceramic powder as a filler can reduce the dielectric loss of epoxy resin packaging materials and improve the electrical breakdown strength of epoxy resin packaging materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment 1: the coupling agent gamma-(2,3-glycidoxy) propyltrimethoxysilane of 5 weight parts is dissolved in the ethanol of 80 weight parts, adds 80 weight parts average particle diameters under stirring state 8 microns of α-phase plate-like Al 2 o 3 Ceramic powder, stirred for 1.5 hours, and dried at 70°C to make alumina powder. Add 0.1 parts by weight of plasticizer di-n-octyl phthalate to 40 parts by weight of EP828 epoxy resin at a temperature of 70°C and mix evenly, then add 80 parts by weight of the above-mentioned alumina powder, mix and stir After 1 hour, vacuum degass in an environment with a vacuum degree of 0.09MPa, then add 8 parts by weight of curing agent 590, stir and mix, then defoam in an environment with a vacuum degree of 50Pa, place it at room temperature for 4 hours, and slowly heat up to 50°C , keep warm for 4h, slowly raise the temperature to 80°C, keep warm for 14h, and cool down to room temperature with the furnace to obtain epoxy resin enc...

Embodiment 2

[0016] Embodiment 2: the coupling agent γ-(2,3-glycidoxy) propyltrimethoxysilane of 7 parts by weight is dissolved in the ethanol of 90 parts by weight, and 90 parts by weight of the average particle diameter of 9 microns of α-phase plate-like Al 2 o 3 Ceramic powder, stirred for 2 hours, dried at 80°C to make alumina powder. Add 0.5 parts by weight of the plasticizer dioctyl phthalate to 50 parts by weight of E51 epoxy resin at a temperature of 80°C and mix evenly, then add 90 parts by weight of the above-mentioned alumina powder, mix and stir After 1.5 hours, vacuum degass in an environment with a vacuum of 0.10 MPa, then add 9 parts by weight of curing agent 590, stir and mix, then defoam in an environment with a vacuum of 60 Pa, place it at room temperature for 5 hours, and slowly heat up to 52 °C , keep warm for 5h, slowly raise the temperature to 90°C, keep warm for 15h, and cool down to room temperature with the furnace to obtain epoxy resin encapsulation material.

...

Embodiment 3

[0018] Embodiment 3: Dissolving the coupling agent gamma-(2,3-glycidoxy) propyltrimethoxysilane of 9 parts by weight in the ethanol of 95 parts by weight, add 110 parts by weight of 9 microns of α-phase plate-like Al 2 o 3 Ceramic powder, stirred for 2.5 hours, and dried at 85°C to make alumina powder. Add 1.0 parts by weight of the plasticizer dioctyl phthalate to 50 parts by weight of EP828 epoxy resin at a temperature of 85°C and mix evenly, then add 110 parts by weight of the above-mentioned alumina powder, mix and stir After 1.5 hours, vacuum degass in an environment with a vacuum of 0.15 MPa, then add 9 parts by weight of curing agent 590, stir and mix, then defoam in an environment with a vacuum of 70 Pa, place it at room temperature for 5 hours, and slowly heat up to 54 °C , keep warm for 5h, slowly raise the temperature to 95°C, keep warm for 16h, and cool down to room temperature with the furnace to obtain epoxy resin encapsulation material.

[0019] It is measure...

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Abstract

The invention discloses an epoxy resin encapsulating material, which is characterized by comprising 40 to 60 weight portions of EP828 epoxy resin or E51 epoxy resin, 80 to 130 weight portions of platy alpha Al2O3 ceramic powder, 5 to 10 weight portions of coupling agent - gamma-(2,3-epoxy propoxide) propyl trimethoxy silane, 8 to 12 weight portions of curing agent 590 and 0.1 to 1.5 weight portions of plasticizer - di-n-octyl phthalandione. The invention also discloses a method for preparing the epoxy resin encapsulating material, which comprises: firstly, dissolving the coupling agent into ethanol, adding the platy alpha Al2O3 ceramic powder into a mixture under the condition of stirring, and preparing alumina powder; and secondly, adding the plasticizer into the epoxy resin, uniformly mixing the plasticizer and the epoxy resin, adding the alumina powder into a mixture, performing mixing and degasification, adding the curing agent into the mixture, and performing vacuum defoamation and curing to obtain the epoxy resin encapsulating material. By adoption of the platy alpha Al2O3 ceramic powder as filler, the dielectric loss tangent value of the obtained material is reduced from 0.11 in the prior art to 0.02, and the electric breakdown strength is improved from 10kV.m<-1> in the prior art to 84-102kV.m<-1>.

Description

technical field [0001] The invention relates to an encapsulation material, and also relates to a preparation method of the encapsulation material. Background technique [0002] The document "Research on the Performance of New Epoxy Resin E-51 Xu Wei, Xu Guifang, etc. "Electronics and Packaging" Volume VII, 2007 Twelfth Issue" discloses a packaging material with silicon dioxide as a filler. The epoxy encapsulation material contains 100 parts by weight of E-51 epoxy resin, 50 parts by weight of silicon dioxide, 10 parts by weight of curing agent, and 2 parts by weight of accelerator. The epoxy resin packaging material has a dielectric coefficient of 7.188, a dielectric loss tangent of 0.11 at a frequency of 1KHz, and an electrical breakdown strength of 10kV.m -1 . Although the dielectric coefficient of the epoxy resin encapsulation material is relatively high, the dielectric loss value is relatively large and the electrical breakdown strength is low. Contents of the invent...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/06C08K5/12C09K3/10
Inventor 樊慧庆邓永丽张洁贺红亮张福平杜金梅
Owner NORTHWESTERN POLYTECHNICAL UNIV
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