Sintering grinding medium and preparation thereof
A technology of abrasives and raw materials, which is applied in the field of sintered abrasives and preparation, to achieve the effects of reducing grinding processing costs, changing grinding processing performance, and improving processing accuracy
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Embodiment 1
[0026] 8% NaO, 15% B 2 o 3 , 60% SiO 2 , 3% Li 2 O, 4% MgO, 7% K 2 O and 3% CaO are mixed evenly, smelted, quenched, dried, pulverized, and sieved to prepare the required binder. Then, 2% binder and 98% 2.5μm corundum were mixed, granulated, heat treated at 1200°C, and sieved to obtain the required sintered corundum abrasive.
Embodiment 2
[0028] 7% NaO, 17% B 2 o 3 , 63% SiO 2 , 2% Li 2 O, 3% MgO, 3% K 2 O, 3% CaO, and 2% ZnO are mixed evenly, melted, quenched, dried, pulverized, and sieved to prepare the required binder. Then, mix 2.5% binder and 97.5% 1.5 μm silicon carbide, granulate, sinter at 1000°C, and sieve to obtain the required sintered silicon carbide abrasive.
Embodiment 3
[0030] 10% NaO, 20% B 2 o 3 , 55% SiO 2 , 4% Li 2 O, 2% MgO, 3% K 2 O, 2% CaO, and 4% ZnO are mixed evenly, melted, quenched, dried, pulverized, and sieved to prepare the required binder. Then, 3.5% binder and 96.5% 1 μm cubic boron nitride were mixed, granulated, sintered at 900° C., and sieved to obtain the desired sintered cubic boron nitride abrasive.
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